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Epoxy Adhesive

Epoxy Adhesive

Epoxy adhesives taking the stresses of tough duty and generations of rigid, flexible, and toughened formulations have met changing design and production requirements for industries ranging from aerospace and appliances to sporting goods and electronics.
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Product Information
STYCAST 2651-40FR can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your...
STYCAST 2651 MM is a filled, low viscosity, general purpose, machinability, epoxy encapsulant. STYCAST 2651 MM contains a soft filler that both reduces abrasion in...
STYCAST 2762 FT is a highly filled, high temperature, thermally conductive epoxy encapsulant. It features excellent chemical resistance, low coefficient of thermal expansion and low...
ECCOBOND 281 BLK epoxy adhesive is an one component formulated to cure rapidly at elevated temperatures. This material does not contain any solvents and eliminates...
ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note:...
Hysol EA 9359.3 is two-component structural adhesive which exhibits high peel and high tensile lap shear strength. It contains 5 mil/0.13 mm glass beads for...
Hysol® EA 9377™ is a moldable plastic shim, excellent microcracking resistance under thermal cycling. High compressive strength, Resistant to microcracking under 2, 000 thermal cycles,...
Highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to...
Henkel MC723 epoxy adhesive is designed for lid attach in flip chip BGA applications. The ultra low moisture absorption at environmental and reliability conditions ensure...
Henkel® A-1177-B is a versatile two component, room temperature curing epoxy adhesive that provides a hard, durable bond when cured
Hysol ® EO1072 is a one component high performance epoxy encapsulant with high Tg and low extractable ionics. It features good shelf life stability and...
HYSOL STYCAST 2762 catalyst 17M-1 two component epoxy encapsulant designed for electronic components exposed to harsh environments. This material is also ideal for large and...
Hysol 193554 Epoxy Hardener, 8 lb
Hysol 193555 Epoxy Resin, 14 lb
Stycast 2651-40 FR is a filled, general purpose, dielectric grade epoxy encapsulant. It features excellent dielectric properties, low viscosity and is Underwriter’s Laboratories approved for...
Hysol® TF 3056FR™ is a low density, thixotropic potting compound. Cured adhesive is self-extinguishing to flame. Density 0.48 g/cc (30 pcf)
Showing 20 of 680 products.
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