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EMI/RFI Shielding Products
Hisco offers EMI/RFI shielding and grounding solutions with our selection of elastomers, fabrics, filters, gasketing, knit, mesh, microwave absorbers, and more.
Shielding Tapes
Product Information
3M EMC Solutions Kit
This innovative kit helps evaluate and troubleshoot near-field radation and EMC shielding and absorbing materials. It is also a terrific training tool.
This kit contains: 3M EMI shielding foil and fabric tapes; 3M EMI absorbers; 3M gaskets and conductive materials; ScanEMC-HC; ScanEM-EC probes; test board; connectors, sample materials, product literature; technical data sheets; EMC products CD.
Electromagnetic interference (EMI) is the disruption of electronic circuitry as a result of electromagnetic induction or electromagnetic radiation emitted from a nearby source. (EMI is designated Radio Frequency Interference (RFI) when the wavelengths occur in the high frequency range.) The interference can degrade or impede the performance of the affected electronic circuits. There are many instances of electronic devices experiencing field failures as a result of EMI/RFI. Hisco has a suite of solutions to assist engineers in addressing EMI issues. EMI shielding tapes are designed for applications requiring reliable point-to-point electrical contact, particularly EMI shielding, grounding and static charge draining. Absorbers are designed to absorb EMI/RFI in the broadband range. These thin, flexible sheets backed with adhesive come in different constructions designed for a broad variety of electronic devices and assemblies. Electrically Conductive Cushioning Gaskets (ECG) and Pads are compressible tapes with good electrical conductivity and excellent cushioning/recovery properties. They offer outstanding gap-filling performance while maintaining good electrical grounding potential. Our application engineers are available to help design the ideal solution to address your EMI/RFI challenges.
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3M 7810 Conductive Acrylic Pad
7810 conductive acrylic pad is a double-sided tape consisting of high-performance adhesive with conductive fillers. It provides an electrical path with adhesive bonding and a heat-transfer path between heat generating components and other cooling devices.
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