Soldering & Desoldering Products

ALPHA Cleanline 7000 is a very low residue flux core wire solder designed for no-clean hand soldering applications. The flux core provides sufficient activity to solder successfully to bare copper and other demanding applications. The unique blend of resin and proprietary non-halide activators provide rapid wetting, while leaving minimal levels of post-soldering residue. This residue is optically clear, soft and easy-to-probe, tack-free and non-corrosive. In some circumstances and over time the residue can have a white milky appearance.

ALPHA Cleanline 7000 is suitable for the hand soldering of electronic assemblies. Tip temperatures of 700 - 750°F are suggested in order to minimize post soldering residue levels. ALPHA Cleanline 7000 is a no-clean core solder and its post-soldering residues may be left on the board.

As is good practice with all hand soldering, it is recommended to preheat the surface to be soldered with the soldering iron before contacting the area with the wire solder, in order to optimize soldering efficiency. If you choose to use a companion liquid flux, NR205 is recommended in order to provide the optimal combination of high long-term reliability and low residue level. NR205 is available in Alpha’s Write Flux flux pens for precise flux application.

Alpha CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA® CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA® CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. The carefully selected Sn/Bi/Ag alloy in ALPHA® CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used. The use of ALPHA® Exactalloy™ performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA® CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

Fluitin AS is an activated rosin cored solder wire developed for general hand soldering applications where halide free flux has been specified. Fluitin AS is suitable for use in commercial no-clean hand soldering application that specifies compliance to J-STD-004-ROL0. It is suited for use in J-STD-001B Class III – High Performance Electronic Products, where halide free has been specified – products where continued high performance or performance on demand is crucial and equipment downtime cannot be tolerated and / or the end use environment may be uncommonly harsh, This classification would typically include military weapons and defense systems, aerospace, life support systems and under the hood automotive electronics.

Alpha Vaculoy solder metals are manufactured using high purity raw materials and the alloy is conditioned using Alpha’s VACULOY® viscosity and drosslowering treatment. This results in a pure low dross high fluidity solder alloy, which is free of cast in impurities and included oxides.

VACULOY treated prior to casting: this removes finely divided suspended oxides that are found in all virgin raw materials, this
increases the fluidity and hence soldering defects.
• The removal of the finely divided oxide reduces drossing rate, the wave stays cleaner, longer.
• Has a proven track record, no need to take chances.

Alpha OM-338 ultra fine feature solder paste is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

ALPHA OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-CSP is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-CSP’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. *Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-

Alpha Fry RA38 SAC305 Cored Wire.

ALPHA SMT Core Plus is a HALOGEN FREE, no-clean core wire solder for hand soldering or automatic feed wire applications. It provides good activity and wetting. The unique rosin and activator system provides soldering results comparable to fully activated core solders. ALPHA SMT Core Plus leaves optically clear, tack-free, non-corrosive residues. ALPHA SMT Core Plus is suitable for use in any commercial hand soldering application that does not utilize a cleaning process after soldering, where IPC-TM-650 2.6.3.3 flux is appropriate and/or compliance with Bellcore Specification TR-NWT-000078. The activator system of ALPHA SMT Core Plus is extremely effective and promotes soldering to moderately tarnished surfaces of the following metals: Beryllium Copper Nickel (Plate), Tin (Plate), Brass Silver Solder, Bronze Solder (Plate), Cadmium (Plate), Solder (Hot Dip), Copper Terne (Plate), Lead Tin (Hot Dip). Alpha NR205 is recommended as a companion touch-up flux.

ALPHA® Telecore HF-850 is the fastest wetting and lowest spattering, Halogen Free and Halide Free cored wire offering from ALPHA®. It performs admirably when benchmarked against Halogen and Halide containing competitive products vailable in the market and is a viable option to meet environmental requirements.
ALPHA® Telecore HF-850’s rapid wetting meets drag soldering and all other common soldering needs. Its clear residue allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort is maintained. All this translates to a safe and environmentally compliant product that is operator friendly and a delight to use. ALPHA® Telecore HF-850 is suitable for use in any commercial no-clean soldering application that specifies compliance to the IPC ROL0 standard. It is suited to such areas of industry (subject to the above criteria) as Consumer Electronics, Automotive, Computer and
peripherals, Mobile devices and all types of household appliances.

ALPHA Telecore XL-825 is a newly developed cored wire that is specifically designed to meet JIS Class AA requirements, with a halide content <1,000ppm, for no-clean lead-free applications. It offers the balance of high SIR reliability and excellent spread characteristics. It is among the best performing products in the ALPHA® Cored Wire Product Portfolio. The payoff is not only an excellent soldering performance Alpha Telecore XL-825, but also a reliable material that is able to comply to IPC flux ROL1 classification. ALPHA Telecore XL-825's fast wetting and low spattering characteristics make it excellent for manual assembly and drag soldering applications. It is safe to use and operator friendly. Inspection is also made easier by its clear residue. It is suited to such areas of industry (subject to above criteria) as TV, Audio equipment, Video, DVD Games box, Automotive, Computer, and peripherals, mobile and hand held devices and all types of household appliances.

ALPHA® UP-78-T No-Clean Solder Paste (9098T) ALPHA UP-78-T is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent fine pitch and high-speed printing properties. ALPHA UP-78-T is designed for reflow in either air or nitrogen surface mount processes where post reflow cleaning is not required. The ALPHA UP-78-T activation system has been optimised to reduce the incidence of non-soldered joints, whilst maintaining long term reliability. The clear, colourless residue is designed to spread from the joint, leaving the assembly suitable for some pin testing applications.

ALPHA Vaculoy SACX0307 is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX0300 variant is used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all Alpha Metals bar solder, Alpha’s proprietary Vaculoy™ alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce dross formation and improve the joint cosmetics. The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscosity can result in increased soldering defects (i.e solder bridging)

Vacuoly® SMG solder is alloyed in Alpha’s proprietary Vaculoy process utilizing materials of the lowest impurity levels available. This provides the basis for it to far exceed the requirements for solder set by J-STD-006 and previous military specification QQS-571F. In addition, Alpha’s unique Vaculoy process removes included oxides. Inspection of each lot of material by both chemical analysis and Dross Inclusion Tests guarantees consistency with regard to metallic and non-metallic impurities, including oxides. The proprietary Vaculoy process used to produce Vaculoy SMG Bar Solder is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscostiy can result in increased soldering defects (i.e. solder bridging). In addition, the extremely low oxide levels in Vaculoy ensure strong, clean and well-formed solder joints. The exceedingly low levels of metallic and non-metallic impurities associated with Vaculoy SMG solder produces the highest quality solder joints while minimizing defect rates. This is due to the superior fluidity of the solder and the elimination of included oxides for greatly reduced drossing and improved wetting characteristics. Vacuoly SMG solder can be used in all applications where regular solder is used (i.e., wave soldering, drag soldering, solder leveling, lead tinning, etc), but is specially produced to meet the very stringent demands of Surface Mount soldering.

ALPHA WS-609 is a halide free neutral pH water soluble solder cream specifically designed for surface mount processes and other demanding electronics assembly applications where post-reflow water cleaning is used. ALPHA WS-609's unique activator systems and water soluble resin carrier are suitable to replace RMA solder creams. APPLICATIONS ALPHA WS-609 is designed for stencil printing. Stencil life is four hours while tack life exceeds six hours at 70-80°F and 30%-60% RH. Based on experience, the maximal RH for this paste is 50%. Higher humidity can cause lower viscosity which may negatively impact print performance. This extended tack feature enables placement of parts long after what is possible with previous formulations. Using the number three particle size configuration, ALPHA WS-609 is suitable for printing through stencil apertures as small as 9 mils in the smallest dimension. ALPHA WS609's activator system allows the flux to penetrate tarnished surfaces among the following metals: Silver Copper Solder (Creams) Gold Solder (Hot Dip) Tin (Hot Dip) Cadmium (Plate) Tin (Plate) Beryllium Copper Nickel (Plate) Lead Bronze

ALPHA WS-809 is formulated for both standard and fine feature pitch stencil printing, at print speeds between 1”/sec (25 mm/sec) and 6”/sec (150 mm/sec) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm), particularly when used in conjunction with ALPHA® Stencils. Blade pressures should be between 1 – 2 lbs/in (0.16 – 0.34 kg/cm), depending on the print speed. The higher the print speed employed, the higher the blade pressure that is required.