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Sarcon® 30X-M Thermal Gap Filler Pad, 200 mm x 150 mm x 0.3 mm, Light Gray

Hisco #:30X-M-20530

MFG #:30X-M

Our Price: $125.00 SH
Manufacturer Lead Time When Not In Stock10 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1125.00
3117.88Save 6%

The Fujipoly 30X-M is a Series XR-M gap filler pad with a width of 200.

The Fujipoly 30X-M Features:
  • Gives the lowest thermal resistance
  • Has a flame retardancy of UL specification 94 V-0
  • Low Molecular Siloxane content is very low.
The Fujipoly 30X-M Specifications:
  • Brand: SARCON®
  • Series: XR-M
  • Product Type: Gap Filler Pad
  • Material: Silicone
  • Material Category: Plastic
  • Color: Light Gray
  • Primary Color: Light Gray
  • Width: 200mm
  • Length: 150mm
  • Thickness: 0.3mm
  • Tensile Strength: 0.5MPa
  • Elongation at Break: 35%
  • Hardness: 80Shore OO
  • Thermal Conductivity: 17W/m.K
  • Applications: Between chassis wall and other surface, Between semi conductor and heat sink, Large area heat transfer to heat sink, Between CPU and heat sink

Product Description

The Fujipoly 30X-M is a Series XR-M gap filler pad with a width of 200.

The Fujipoly 30X-M Features:
  • Gives the lowest thermal resistance
  • Has a flame retardancy of UL specification 94 V-0
  • Low Molecular Siloxane content is very low.
The Fujipoly 30X-M Specifications:
  • Brand: SARCON®
  • Series: XR-M
  • Product Type: Gap Filler Pad
  • Material: Silicone
  • Material Category: Plastic
  • Color: Light Gray
  • Primary Color: Light Gray
  • Width: 200mm
  • Length: 150mm
  • Thickness: 0.3mm
  • Tensile Strength: 0.5MPa
  • Elongation at Break: 35%
  • Hardness: 80Shore OO
  • Thermal Conductivity: 17W/m.K
  • Applications: Between chassis wall and other surface, Between semi conductor and heat sink, Large area heat transfer to heat sink, Between CPU and heat sink

Technical Information

BrandFujipoly
Weight: 0.114
Our Price: $125.00 SH
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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