Hisco #: 9-B13341AATTT-6000 MFG #: 9-B13341AATTT
Call for Pricing Each-EA
Out of Stock 42 days
0.00 lbs per EA
1600 Item must be ordered in multiples of 1600
  • Product Information

The Autosplice 9-B13341AATTT is a Solderball pin. Solderball pin technology incorporates a precision formed solder sphere onto a high conductivity copper pin. It is designed to work with pick-and-place automated equipment for high speed assembly. Solderball pins are designed in various ranges and standoff heights to accommodate a variety of applications. Shipped in Tape and Reel.

Autosplice 9-B13341AATTT Features:
  • Solder ball composition: 96.5 Sn/3.0Ag/0.5 CuPin
  • Material: Copper
Autosplice 9-B13341AATTT Specifications:
  • Diameter: 0.071 +/- .004” for 0.11” SMT pad
  • Compensation: .020”
  • Stack up height: up to 0.195” Insulator disk
  • Color: blue
  • See Drawing for more information