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ALPHA OM-5300 No-Clean Tin-Lead Solder Paste, Sn63Pb37, 90-3-M17, 500g Jar

Hisco #:151855-1998

MFG #:OM-5300

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $87.63 Jar-JR
Manufacturer Lead Time When Not In Stock21 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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The ALPHA OM-5300 is a Series OM5300 no-clean solder paste .

The ALPHA OM-5300 Features:
  • Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
  • Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
  • Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
  • Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
  • Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
  • Excellent response to pause performance, generating fewer defects due to start up
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • Efficient activation system providing defect free soldering with a wide range of oven profiles
  • High yield for in circuit testing (low level of false negatives)
The ALPHA OM-5300 Specifications:
  • Series: OM5300
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g

Product Description

The ALPHA OM-5300 is a Series OM5300 no-clean solder paste .

The ALPHA OM-5300 Features:
  • Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
  • Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
  • Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
  • Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
  • Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
  • Excellent response to pause performance, generating fewer defects due to start up
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • Efficient activation system providing defect free soldering with a wide range of oven profiles
  • High yield for in circuit testing (low level of false negatives)
The ALPHA OM-5300 Specifications:
  • Series: OM5300
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandAlpha
SeriesOM-5300
Chemical CompositionSn63Pb37
Product TypeNo-Clean Solder Paste
Physical FormPaste
ApplicationsSoldering
Standards MetIPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
Container TypeJar
Capacity500g
Minimum Storage Temperature32
Maximum Storage Temperature50
Weight: 0.002
Country Of Origin: MX
Our Price: $87.63 Jar-JR
 
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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