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CircuitMedic® B4-064-1013-100 Flextac BGA Rework Stencil, 0.394 x 0.512 in 10/PK

Hisco #:B4-064-1013-100-10123

MFG #:B4-064-1013-100

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock10 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-064-1013-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-064-1013-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-064-1013-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 10 x 13mm
  • Component Length: 10mm
  • Component Width: 13mm
  • Number of Balls: 64
  • Ball Pattern: 8 x 8 Array
  • Package Quantity: 10PC/PK

Product Description

The CircuitMedic B4-064-1013-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-064-1013-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-064-1013-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 10 x 13mm
  • Component Length: 10mm
  • Component Width: 13mm
  • Number of Balls: 64
  • Ball Pattern: 8 x 8 Array
  • Package Quantity: 10PC/PK

Technical Information

BrandCircuitMedic
ApplicationsApplying Solder Paste for BGA Rework
AvailabilityIn Stock
Length0.512in
MaterialPolymer Film
Material CategoryPlastic
Package Quantity10PC/PK
Product TypeFlextac Rework Stencils
Storage ConditionsAmbient
Thickness0.004in
Width0.394in
Type of StencilFlextac Rework
Pitch1mm
Aperture Size0.02in
Component Size10 x 13mm
Component Length10mm
Component Width13mm
Number of Balls64
Ball Pattern8 x 8 Array
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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