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Flextac Rework Stencils, Aperture Size 0.01, 0.004

Hisco #:B4-088-0811-080-10123

MFG #:B4-088-0811-080

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-088-0811-080 is a flextac rework stencils with a pitch of 0.8.

The CircuitMedic B4-088-0811-080 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-088-0811-080 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 8 x 11mm
  • Component Length: 8mm
  • Component Width: 11mm
  • Number of Balls: 88
  • Ball Pattern: 8 x 12 Array
  • Package Quantity: 10PK

Product Description

The CircuitMedic B4-088-0811-080 is a flextac rework stencils with a pitch of 0.8.

The CircuitMedic B4-088-0811-080 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-088-0811-080 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 8 x 11mm
  • Component Length: 8mm
  • Component Width: 11mm
  • Number of Balls: 88
  • Ball Pattern: 8 x 12 Array
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Type of StencilFlextac Rework
Thickness0.004in
Aperture Size0.01in
Pitch0.8mm
MaterialPolymer Film
Material CategoryPlastic
Component Size8 x 11mm
Component Length8mm
Component Width11mm
Number of Balls88
Ball Pattern8 x 12 Array
Package Quantity10PK
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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