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BGA REWORK STENCIL .004 12X12 ARRAY 10/PK

Hisco #:B4-118-1515-127-10123

MFG #:B4-118-1515-127

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-118-1515-127 are rework stencils with 118 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut and ensure a highly accurate aperture size.

CircuitMedic B4-118-1515-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-118-1515-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 15 x 15mm
  • Component Length: 15mm
  • Component Width: 15mm
  • Number of Balls: 118
  • Ball Pattern: 12 x 12 Array
  • Package Quantity: 10PK

Product Description

The CircuitMedic B4-118-1515-127 are rework stencils with 118 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut and ensure a highly accurate aperture size.

CircuitMedic B4-118-1515-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-118-1515-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 15 x 15mm
  • Component Length: 15mm
  • Component Width: 15mm
  • Number of Balls: 118
  • Ball Pattern: 12 x 12 Array
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
ApplicationsApplying Solder Paste for BGA Rework
Length15mm
MaterialPolymer Film
Material CategoryPlastic
Package Quantity10PK
Product TypeFlextac Rework Stencils
SeriesBGA
Thickness0.004in
Width15mm
Type of StencilFlextac Rework
Pitch1.27mm
Aperture Size0.02in
Component Size15 x 15mm
Component Length15mm
Component Width15mm
Number of Balls118
Ball Pattern12 x 12 Array
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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