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FLEXTAC BGA REWORK STENCIL, 10 PCS PER PKG

Hisco #:B4-257-1616-080-10123

MFG #:B4-257-1616-080

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-257-1616-080 are 16 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut and ensure a highly accurate aperture size.

CircuitMedic B4-257-1616-080 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-257-1616-080 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 16 x 16mm
  • Component Length: 16mm
  • Component Width: 16mm
  • Number of Balls: 257
  • Package Quantity: 10PC/PK

Product Description

The CircuitMedic B4-257-1616-080 are 16 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut and ensure a highly accurate aperture size.

CircuitMedic B4-257-1616-080 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-257-1616-080 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 16 x 16mm
  • Component Length: 16mm
  • Component Width: 16mm
  • Number of Balls: 257
  • Package Quantity: 10PC/PK

Technical Information

BrandCircuitMedic
ApplicationsApplying Solder Paste for BGA Rework
Length16mm
MaterialPolymer Film
Material CategoryPlastic
Package Quantity10PC/PK
Product TypeFlextac Rework Stencils
SeriesBGA
Storage ConditionsAmbient
Thickness0.004in
Width16mm
Type of StencilFlextac Rework
Pitch0.8mm
Aperture Size0.01in
Component Size16 x 16mm
Component Length16mm
Component Width16mm
Number of Balls257
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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