US_HISCO_SPIRE
CircuitMedic logo

Flextac Rework Stencils, Aperture Size 0.02, 0.004

Hisco #:B4-360-2323-100-10123

MFG #:B4-360-2323-100

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-360-2323-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-360-2323-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-360-2323-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 360
  • Ball Pattern: 22 x 22 P5-Row
  • Package Quantity: 10PK

Product Description

The CircuitMedic B4-360-2323-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-360-2323-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-360-2323-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 360
  • Ball Pattern: 22 x 22 P5-Row
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Type of StencilFlextac Rework
Thickness0.004in
Aperture Size0.02in
Pitch1mm
MaterialPolymer Film
Material CategoryPlastic
Component Size23 x 23mm
Component Length23mm
Component Width23mm
Number of Balls360
Ball Pattern22 x 22 P5-Row
Package Quantity10PK
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
North America's Premier Distributor of Mission Critical Materials ® © 2008-  Copyright Hisco, Inc. Industrial Distributor. All rights reserved