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BGA REWORK STENCIL .004 22X22 P7-ROW 10/PKG

Hisco #:B4-456-2323-100-10123

MFG #:B4-456-2323-100

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-456-2323-100 are rework stencils with 456 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B4-456-2323-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-456-2323-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 456
  • Ball Pattern: 22 x 22 Array
  • Package Quantity: 10PK

Product Description

The CircuitMedic B4-456-2323-100 are rework stencils with 456 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B4-456-2323-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B4-456-2323-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 456
  • Ball Pattern: 22 x 22 Array
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
SeriesBGA
Material CategoryPlastic
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Length23mm
MaterialPolymer Film
Width23mm
Thickness0.004in
Type of StencilFlextac Rework
Pitch1mm
Aperture Size0.02in
Package Quantity10PK
Component Size23 x 23mm
Component Length23mm
Component Width23mm
Number of Balls456
Ball Pattern22 x 22 Array
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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