US_HISCO_SPIRE
CircuitMedic logo

CircuitMedic® B4-783-2929-100 Flextac BGA Rework Stencil, 1.1417 x 1.1417 in 10/PK

Hisco #:B4-783-2929-100-10123

MFG #:B4-783-2929-100

Our Price: $179.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B4-783-2929-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-783-2929-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-783-2929-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 29 x 29mm
  • Component Length: 29mm
  • Component Width: 29mm
  • Number of Balls: 783
  • Ball Pattern: 29 x 29 Full Array
  • Package Quantity: 10PK

Product Description

The CircuitMedic B4-783-2929-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-783-2929-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-783-2929-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 29 x 29mm
  • Component Length: 29mm
  • Component Width: 29mm
  • Number of Balls: 783
  • Ball Pattern: 29 x 29 Full Array
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
Material CategoryPlastic
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Length1.1417in
MaterialPolymer Film
Width1.1417in
Thickness0.004in
Type of StencilFlextac Rework
Pitch1mm
Aperture Size0.02in
Package Quantity10PK
Storage ConditionsAmbient
Component Size29 x 29mm
Component Length29mm
Component Width29mm
Number of Balls783
Ball Pattern29 x 29 Full Array
Weight: 45.5
Our Price: $179.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
North America's Premier Distributor of Mission Critical Materials ® © 2008-  Copyright Hisco, Inc. Industrial Distributor. All rights reserved