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BGA REWORK STENCIL .006 17X17 P5-ROW 10/PKG

Hisco #:B6-241-2323-127-10123

MFG #:B6-241-2323-127

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-241-2323-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-241-2323-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 241
  • Ball Pattern: 17 x 17 P5-Row
  • Package Quantity: 10PK

Product Description

The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-241-2323-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-241-2323-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 241
  • Ball Pattern: 17 x 17 P5-Row
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
ApplicationsApplying Solder Paste for BGA Rework
Length23mm
MaterialPolymer Film
Material CategoryPlastic
Package Quantity10PK
Product TypeFlextac Rework Stencils
SeriesBGA
Thickness0.006in
Width23mm
Type of StencilFlextac Rework
Pitch1.27mm
Component Size23 x 23mm
Component Length23mm
Component Width23mm
Number of Balls241
Ball Pattern17 x 17 P5-Row
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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