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BGA REWORK STENCIL .006 20X20 P4 ROW 10PC/PKG

Hisco #:B6-292-2727-127-10123

MFG #:B6-292-2727-127

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock39 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B6-292-2727-127 are rework stencils with 292 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-292-2727-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-292-2727-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 27 x 27mm
  • Component Length: 27mm
  • Component Width: 27mm
  • Number of Balls: 292
  • Ball Pattern: 20 x 20 P4-Row
  • Package Quantity: 10PC/PK

Product Description

The CircuitMedic B6-292-2727-127 are rework stencils with 292 balls made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-292-2727-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-292-2727-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 27 x 27mm
  • Component Length: 27mm
  • Component Width: 27mm
  • Number of Balls: 292
  • Ball Pattern: 20 x 20 P4-Row
  • Package Quantity: 10PC/PK

Technical Information

BrandCircuitMedic
SeriesBGA
Material CategoryPlastic
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Length27mm
MaterialPolymer Film
Width27mm
Thickness0.006in
Type of StencilFlextac Rework
Pitch1.27mm
Aperture Size0.02in
Package Quantity10PC/PK
Component Size27 x 27mm
Component Length27mm
Component Width27mm
Number of Balls292
Ball Pattern20 x 20 P4-Row
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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