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Flextac BGA Repair Stencil, 25 x 25mm Square with 361 Balls, 10 per Pack

Hisco #:B8-361-2525-127-10123

MFG #:B8-361-2525-127

Made in the USA
Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock40 days
Minimum Order QTY: 5
Item must be ordered in multiples of 5

The CircuitMedic B8-361-2525-127 are 25 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B8-361-2525-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B8-361-2525-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.008in
  • Aperture Size: 0.03in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 25 x 25mm
  • Component Length: 25mm
  • Component Width: 25mm
  • Number of Balls: 361
  • Ball Pattern: 19 x 19 Array
  • Package Quantity: 10PK

Product Description

The CircuitMedic B8-361-2525-127 are 25 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B8-361-2525-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B8-361-2525-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.008in
  • Aperture Size: 0.03in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 25 x 25mm
  • Component Length: 25mm
  • Component Width: 25mm
  • Number of Balls: 361
  • Ball Pattern: 19 x 19 Array
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
ApplicationsApplying Solder Paste for BGA Rework
Length25mm
MaterialPolymer Film
Material CategoryPlastic
Package Quantity10PK
Product TypeFlextac Rework Stencils
SeriesBGA
Thickness0.008in
Width25mm
Type of StencilFlextac Rework
Pitch1.27mm
Aperture Size0.03in
Component Size25 x 25mm
Component Length25mm
Component Width25mm
Number of Balls361
Ball Pattern19 x 19 Array
Weight: 0.15
Country Of Origin: US
Our Price: $129.00 PK
 
Minimum Order QTY: 5
Item must be ordered in multiples of 5
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