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TRA-BOND 933-1, 22.5G EFD SYR WHT PISTON

1188896-34899 MFG #: 1188896
$38.38 / SZ
Available to Order - 0 on Hand
  • Brand Name: Henkel
  • Series: 933-1
  • Product Type: Epoxy Resin
  • Hardness: 92Shore D
  • Color: Black
  • Primary Color: Black
  • Physical Form: Liquid/Paste
  • Cure Time: 2h
  • Viscosity Measurement: 360500mPa/s
  • Shelf Life: 365 Days From Date of Manufacture
  • Chemical Composition: Aluminum Oxide,Fibrous, Limestone, Epoxy Resin, Epoxy Resin Modifier, P-Tert-Butylphenyl 1-(2,3-Epoxy)Propyl Ether, Quartz (SiO2), Carbon Black
  • Length: 3.7 in.
  • Specific Gravity: 2
  • Width: 1.0 in.
  • Height: 1.1 in.
  • VOCs Content: <3%
  • Odor: Slight
  • Cure Type: Heat Cure
  • Dielectric Strength: 1000V/mil
  • Container Capacity: 22.5g
  • Container Type: Syringe
  • Applications: Encapsulating Microelectronic Chips
  • Storage Conditions: -40C/-104F

HazardousThis item is hazardous and may be subject to an additional handling fee.

The Henkel 1188896 is a Series 933-1 epoxy resin .

The Henkel 1188896 Features:
  • One component
  • Electrically Insulating
  • Provides environmental and mechanical protection
The Henkel 1188896 Specifications:
  • Series: 933-1
  • Product Type: Epoxy Resin
  • Hardness: 92Shore D
  • Color: Black
  • Primary Color: Black
  • Physical Form: Liquid/Paste
  • Cure Time: 2h
  • Viscosity Measurement: 360500mPa/s
  • Shelf Life: 365days
  • Chemical Composition: Aluminum Oxide,Fibrous, Limestone, Epoxy Resin, Epoxy Resin Modifier, P-Tert-Butylphenyl 1-(2,3-Epoxy)Propyl Ether, Quartz (SiO2), Carbon Black
  • Specific Gravity: 2
  • VOCs Content: <3%
  • Odor: Slight
  • Cure Type: Heat Cure
  • Dielectric Strength: 1000V/mil
  • Container Capacity: 22.5g
  • Container Type: Syringe
  • Applications: Encapsulating Microelectronic Chips
Pack: Unit
QTY