EF-2202 VOC-Free No-Clean Solder Flux, 5 Gallon Pail
Hisco #:142810-0005-1998
MFG #:142810-0005
Our Price: $214.95 Pail-PA
Availability: 3 In Stock
Manufacturer Estimated Lead Time When Not In Stock: 22 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 214.95 | |
| 5 | 210.80 | Save |
| 15 | 206.85 | Save |
The ALPHA 142810-0005 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.
ALPHA 142810-0005 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin
- Shelf Life: 18month
- Applications: Selective Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Suitable for selective soldering process,
- Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics
Product Description
Technical Information
SDS/TDS
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA 142810-0005 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.
ALPHA 142810-0005 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin
- Shelf Life: 18month
- Applications: Selective Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Suitable for selective soldering process,
- Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics
Technical Information
Brand: Alpha
Availability: In Stock
Weight: 42.5
Country Of Origin: MX
Harmonized Code: 3810.90.5000
UPC Code: No UPC
Additional Resources
Our Price: $214.95 Pail-PA
Availability: 3 In Stock
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1