Loctite® Chipbonder® 3563™ Snap Cure, Capillary Flow Epoxy Underfill, 10 mL Syringe

144828-V73-34899 MFG #: 144828-V73
$39.52 / EA
Available to Order - 0 on Hand
  • Brand Name: Henkel
  • Series: 3563
  • Product Type: Epoxy Adhesive
  • Hardness: 88Shore D
  • Color: White
  • Primary Color: White
  • Physical Form: Liquid
  • Cure Time: >5min
  • Viscosity Measurement: 5000 to 12000mPa/s
  • Shelf Life: 365 Days From Date of Manufacture
  • Chemical Composition: Epoxy Resin, Silica, Epoxy Resin Modifier, 2-Propyl-1h-Imidazole, Imidazole
  • Specific Gravity: 1.52
  • VOCs Content: 8.27g/L
  • Odor: Odorless
  • Cure Type: Heat Cure
  • Dielectric Strength: 33.5kV/mm
  • Elongation at Break: 3%
  • Gel Time: 12h
  • Container Capacity: 10ml
  • Container Type: Syringe
  • Applications: Underfill for Flip Chip Devices
  • Container Size: 10 mL
  • Storage Conditions: -104F

The Henkel 144828-V73 is a Series 3563 epoxy adhesive .

The Henkel 144828-V73 Specifications:
  • Series: 3563
  • Product Type: Epoxy Adhesive
  • Hardness: 88Shore D
  • Color: White
  • Primary Color: White
  • Physical Form: Liquid
  • Cure Time: >5min
  • Viscosity Measurement: 5000 to 12000mPa/s
  • Chemical Composition: Epoxy Resin, Silica, Epoxy Resin Modifier, 2-Propyl-1h-Imidazole, Imidazole
  • Specific Gravity: 1.52
  • VOCs Content: 8.27g/L
  • Odor: Odorless
  • Cure Type: Heat Cure
  • Dielectric Strength: 33.5kV/mm
  • Elongation at Break: 3%
  • Gel Time: 12h
  • Tensile Strength‎: 10000psi
  • Container Capacity: 10ml
  • Applications: Underfill for Flip Chip Devices
Pack: Unit
QTY