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ALPHA WS-809 Water-Soluble Solder Paste, Sn62Pb36Ag2.0, 89.8-3-M18, 700 Gram Cartridge

Hisco #:148977-1998

MFG #:WS-809

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $131.60 Cartridge-CQ
Manufacturer Lead Time When Not In Stock11 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.

The ALPHA WS-809 Features:
  • Excellent volume transfer efficiency over broad range of environmental conditions
  • Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
  • High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
  • Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
  • Water cleanable after two paste reflow cycles
  • Excellent low voiding performance that exceeds IPC Class III requirement
  • Superior solder spread performance on Cu OSP
The ALPHA WS-809 Specifications:
  • Series: WS809
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn62Pb37
  • Odor: Odorless
  • Specific Gravity: 4.4g/cc
  • Flash Point: 185°C
  • Applications: Soldering, Desoldering
  • Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
  • Container Type: Cartridge
  • Capacity: 700g

Product Description

The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.

The ALPHA WS-809 Features:
  • Excellent volume transfer efficiency over broad range of environmental conditions
  • Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
  • High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
  • Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
  • Water cleanable after two paste reflow cycles
  • Excellent low voiding performance that exceeds IPC Class III requirement
  • Superior solder spread performance on Cu OSP
The ALPHA WS-809 Specifications:
  • Series: WS809
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn62Pb37
  • Odor: Odorless
  • Specific Gravity: 4.4g/cc
  • Flash Point: 185°C
  • Applications: Soldering, Desoldering
  • Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
  • Container Type: Cartridge
  • Capacity: 700g

Technical Information

BrandAlpha
SeriesWS-809
Chemical CompositionSn63Pb37
Product TypeWater-Soluble Solder Paste
ApplicationsSoldering, Desoldering
Capacity700g
Physical FormPaste
Container TypeCartridge
OdorOdorless
Standards MetIPC Class III, IPC J-STD-005, IPC J-STD-004A
Flash Point185°C
Specific Gravity4.4g/cc
Minimum Storage Temperature34
Maximum Storage Temperature50
Weight: 0.002
Country Of Origin: MX

Additional Resources

Our Price: $131.60 Cartridge-CQ
 
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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