OM-338-CSP Lead Free No-Clean Solder Paste, SAC305, 88.3-M11, 500g Jar
150787-1998
MFG #: 150787
Available to Order - 0 on Hand
- Brand Name: Alpha
- Series: OM-338-CSP
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Applications: Soldering
- Standards Met: RoHS Compliant, IPC 7095, IPC J-STD-004, IPC J-STD-005, DIN Standard 32 513
- Container Type: Jar
- Capacity: 500g
- Minimum Storage Temperature: 32
- Maximum Storage Temperature: 50
- Color: Clear
- Container Size: 500 g
The Alpha 150787 is a lead free solder paste designed to minimize transition concerns from tin/lead to lead free solder paste and used in a variety of applications.
Alpha 150787 Features:
Alpha 150787 Features:
- Maximizes reflow yield for lead free processing
- Excellent print consistency with high process capability
- Print speeds of up to 200mm/sec enabling fast print cycle time
- Wide reflow profile window with good solderability
- Excellent solder and flux cosmetics after reflow soldering
- Compatible with either nitrogen or air reflow
- Series: OM-338-CSP
- Product type: Lead free solder paste
- Physical form: Paste
- Chemical composition: SAC305
- Container: Jar
- Size: 500g
- Standards met: JESD97, IPC 7095 Class III, J-STD-005, RoHS