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OM-338-CSP Lead Free No-Clean Solder Paste, SAC305, 88.3-M11, 500g Jar

150787-1998 MFG #: 150787
$106.02 / JR
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24 $102.91
72 $99.98 Save 3 %
Available to Order - 0 on Hand
Alpha Solder Paste Jar
  • Brand Name: Alpha
  • Series: OM-338-CSP
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Product Type: Lead-Free Solder Paste
  • Physical Form: Paste
  • Applications: Soldering
  • Standards Met: RoHS Compliant, IPC 7095, IPC J-STD-004, IPC J-STD-005, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g
  • Minimum Storage Temperature: 32
  • Maximum Storage Temperature: 50
  • Color: Clear
  • Container Size: 500 g
The Alpha 150787 is a lead free solder paste designed to minimize transition concerns from tin/lead to lead free solder paste and used in a variety of applications.

Alpha 150787 Features:
  • Maximizes reflow yield for lead free processing
  • Excellent print consistency with high process capability
  • Print speeds of up to 200mm/sec enabling fast print cycle time
  • Wide reflow profile window with good solderability
  • Excellent solder and flux cosmetics after reflow soldering
  • Compatible with either nitrogen or air reflow
Alpha 150787 Specifications:
  • Series: OM-338-CSP
  • Product type: Lead free solder paste
  • Physical form: Paste
  • Chemical composition: SAC305
  • Container: Jar
  • Size: 500g
  • Standards met: JESD97, IPC 7095 Class III, J-STD-005, RoHS
Pack: Jar
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