ALPHA OM-338-CSP Lead Free No-Clean Solder Paste, SAC305, 88.3-M11, 500 Gram Jar

The ALPHA OM-338CSP is a lead free solder paste designed to minimize transition concerns from tin/lead to lead free solder paste and used in a variety of applications.

ALPHA OM-338CSP Features:

• Maximizes reflow yield for lead free processing
• Excellent print consistency with high process capability
• Print speeds of up to 200mm/sec enabling fast print cycle time
• Wide reflow profile window with good solderability
• Excellent solder and flux cosmetics after reflow soldering
• Compatible with either nitrogen or air reflow

ALPHA OM-338CSP Specifications:

• Series: OM-338-CSP
• Product type: Lead free solder paste
• Physical form: Paste
• Chemical composition: SAC305
• Container: Jar
• Size: 500g
• Standards met: JESD97, IPC 7095 Class III, J-STD-005, RoHS