Customer #:
Ship To:
{{vm.session.shipTo.lastName}} {{vm.session.shipTo.firstName}},
Change Customer/Ship To
International Settings
Sign Out
Cancel
Menu
Sign In
|
Create an account
|
Contact us
Menu
My Account
|
Contact us
|
Sign Out
Request a Quote
|
View my cart
Sign In
Create an account
Contact us
My Account
Contact us
Sign Out
Products
Brands
Services
Electronics Assembly
Aerospace
Medical
Automotive
General Industrial
Products
Abrasives
Adhesives, Sealants, & Tapes
Benches & Seating
Chemicals & Cleaning Supplies
Cleaning & Laboratory
Electrical
Fasteners & Hardware
Hand & Power Tools
Janitorial & Office Supplies
Labeling & Identification
Lighting & Magnification
Material Handling & Storage
Motion Control & Fluid Power
Packaging & Shipping
Paints & Coatings
Safety & Personal Protection
Soldering & Rework
Static Control
Test & Measurement
- Shop By Market
- Specials
Brands
3M
Alpha
BONDERITE
LOCTITE
AkzoNobel
Brady
Vantage
Parker LORD
WACKER
Elkem
View All Suppliers
Services
Documented Cost Savings
Custom Converted Solutions
Custom Adhesives Packaging
Vendor Managed Inventory/RFID
IMMEX/Maquiladora program
View All Services
Home
Soldering & Rework
Solder
Solder Paste
ALPHA WS-809 Water-Soluble Solder Paste, Sn63Pb37, 89.8-3-M18, 700g Cartridge
ALPHA WS-809 Water-Soluble Solder Paste, Sn63Pb37, 89.8-3-M18, 700g Cartridge
155227-1998
MFG #: WS-809
$0.18492
/ CQ
Available to Order - 0 on Hand
Brand Name:
Alpha
Series:
WS-809
Chemical Composition:
Sn63Pb37
Product Type:
Water-Soluble Solder Paste
Physical Form:
Paste
Odor:
Odorless
Specific Gravity:
4.4g/cc
Flash Point:
185°C
Applications:
Soldering, Desoldering
Standards Met:
IPC Class III, IPC J-STD-005, IPC J-STD-004A
Container Type:
Cartridge
Capacity:
700g
Minimum Storage Temperature:
32
Maximum Storage Temperature:
50
The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.
The ALPHA WS-809 Features:
Excellent volume transfer efficiency over broad range of environmental conditions
Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
Water cleanable after two paste reflow cycles
Excellent low voiding performance that exceeds IPC Class III requirement
Superior solder spread performance on Cu OSP
The ALPHA WS-809 Specifications:
Series: WS809
Product Type: Water-Soluble Solder Paste
Physical Form: Paste
Chemical Composition: Sn63Pb37
Odor: Odorless
Specific Gravity: 4.4g/cc
Flash Point: 185°C
Applications: Soldering, Desoldering
Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
Container Type: Cartridge
Capacity: 700g
Technical Data Sheet
()
QTY
Add to List
North America's Premier Distributor of Mission Critical Materials
®
©
2008-
Copyright Hisco, Inc. Industrial Distributor. All rights reserved