OM-363 Lead Free No-Clean Solder Paste, SAC305, 88.5-4-M13, 500g Jar
159685-1998
MFG #: 159685
$113.63
/ JR
Available to Order - 0 on Hand
- Brand Name: Alpha
- Series: OM-363
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Applications: Soldering
- Standards Met: RoHS Compliant, Meets IPC7095 Class III Requirement, IPC J-STD-005
- Container Type: Cartridge
- Capacity: 600g
- Color: Clear
- Container Size: 600 g
- Type: No Clean
- Viscosity: 1300 Poise
The Alpha 159685 is a Series OM363 no-clean solder paste .
The Alpha 159685 Features:- Long Stencil Life:consistent performance for at least 8 hours of continuous printing without addition of new paste
- Long, High Tack Force Life:ensures high pick-and-place yields, good self-alignment
- Wide Reflow Profile Window:allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
- Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
- Excellent Coalescence and Wetting performance:coalesced 180µm circle deposit, even at high soak profile environment
- Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering, even using long/high thermal soaking, without charring or burning
- Excellent Voiding performance:Meets IPC7095 Class III Requirement
- Halogen Content:Halogen-free
- Residue:Excellent Pin Testing property
- Safe and Environmentally Friendly:Materials comply with RoHS and Halogen-free requirements, as well as TOSCA & EINECS
- Series: OM363
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Applications: Soldering
- Standards Met: RoHS Compliant, Meets IPC7095 Class III Requirement, IPC J-STD-005
- Container Type: Cartridge
- Capacity: 600g