OM-363 Lead Free No-Clean Solder Paste, SAC305, 88.5-4-M13, 500g Jar

159685-1998 MFG #: 159685
$113.63 / JR
Available to Order - 0 on Hand
  • Brand Name: Alpha
  • Series: OM-363
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Applications: Soldering
  • Standards Met: RoHS Compliant, Meets IPC7095 Class III Requirement, IPC J-STD-005
  • Container Type: Cartridge
  • Capacity: 600g
  • Color: Clear
  • Container Size: 600 g
  • Type: No Clean
  • Viscosity: 1300 Poise

The Alpha 159685 is a Series OM363 no-clean solder paste .

The Alpha 159685 Features:
  • Long Stencil Life:consistent performance for at least 8 hours of continuous printing without addition of new paste
  • Long, High Tack Force Life:ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window:allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
  • Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting performance:coalesced 180µm circle deposit, even at high soak profile environment
  • Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering, even using long/high thermal soaking, without charring or burning
  • Excellent Voiding performance:Meets IPC7095 Class III Requirement
  • Halogen Content:Halogen-free
  • Residue:Excellent Pin Testing property
  • Safe and Environmentally Friendly:Materials comply with RoHS and Halogen-free requirements, as well as TOSCA & EINECS
The Alpha 159685 Specifications:
  • Series: OM363
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC 305
  • Applications: Soldering
  • Standards Met: RoHS Compliant, Meets IPC7095 Class III Requirement, IPC J-STD-005
  • Container Type: Cartridge
  • Capacity: 600g
Pack: Jar
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