ALPHA OM-565 HRL3 Solder Paste Alloy, 6" Cartridge, 600 Grams, Type 4

ALPHA OM-565 HRL3 is a low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages. ALPHA OM-565 HRL3 is designed to enable target reflow temperatures of 347 °F with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melting point solders including excellent compatibility when used in combination with other tested assembly products, such as rework fluxes and cored solder wires. The HRL3 alloy offers superior thermomechanical and drop shock performance compared to existing low temperature solutions.

ALPHA OM-565 HRL3 Features:

• Enables target peak reflow of 347 °F for excellent HiP/NWO performance
• Mitigates warpage induced defects such as hot tearing for temperature sensitive packages
• Compatible with HRL3 alloy for enhanced thermomechanical and drop shock reliability
• Improves energy efficiency and reduces energy costs in the assembly process
• Presents 8-hour stencil life in ambient and elevated condition
• Reflowable in Air and Nitrogen

ALPHA OM-565 HRL3 Specifications:

• Brand: ALPHA
• Format: 6-Inch Cartridge
• Powder Size: Type 4
• Tack Force vs. Time and Humidity: Pass, 24 hrs at 25%, 50% and 75% RH
• Cold Slump (77°F /50% RH): Pass, no bridging above 0.20 mm
• Hot Slump (262°F /10 min): Pass, no bridging above 0.25 mm
• Speed: Formulated for stencil printing at speeds between 25 mm/s (1.0 in/s) and 150 mm/s (6.0 in/s)
• Stencil Release Speed: >5.0 mm/s preferred