Sarcon® 30X-M Thermal Gap Filler Pad, 200 mm x 150 mm x 0.3 mm, Light Gray
Hisco #:30X-M-20530
MFG #:30X-M
$
Manufacturer Lead Time When Not In Stock: 11 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The Fujipoly 30X-M is a Series XR-M gap filler pad with a width of 200.
The Fujipoly 30X-M Features:- Gives the lowest thermal resistance
- Has a flame retardancy of UL specification 94 V-0
- Low Molecular Siloxane content is very low.
- Brand: SARCON®
- Series: XR-M
- Product Type: Gap Filler Pad
- Material: Silicone
- Material Category: Plastic
- Color: Light Gray
- Primary Color: Light Gray
- Width: 200mm
- Length: 150mm
- Thickness: 0.3mm
- Tensile Strength: 0.5MPa
- Elongation at Break: 35%
- Hardness: 80Shore OO
- Thermal Conductivity: 17W/m.K
- Applications: Between chassis wall and other surface, Between semi conductor and heat sink, Large area heat transfer to heat sink, Between CPU and heat sink
Product Description
Technical Information
Back to top
Product Description
The Fujipoly 30X-M is a Series XR-M gap filler pad with a width of 200.
The Fujipoly 30X-M Features:- Gives the lowest thermal resistance
- Has a flame retardancy of UL specification 94 V-0
- Low Molecular Siloxane content is very low.
- Brand: SARCON®
- Series: XR-M
- Product Type: Gap Filler Pad
- Material: Silicone
- Material Category: Plastic
- Color: Light Gray
- Primary Color: Light Gray
- Width: 200mm
- Length: 150mm
- Thickness: 0.3mm
- Tensile Strength: 0.5MPa
- Elongation at Break: 35%
- Hardness: 80Shore OO
- Thermal Conductivity: 17W/m.K
- Applications: Between chassis wall and other surface, Between semi conductor and heat sink, Large area heat transfer to heat sink, Between CPU and heat sink
Technical Information
Brand: Fujipoly
Weight: 0.114
$
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1