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NXG1 Series Lead Free No-Clean Solder Paste, Type 3, SAC305, 500g Jar

Hisco #:70-3213-0810-16600

MFG #:70-3213-0810

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Made in the USA
Our Price: $180.45 Jar-JR
Manufacturer Lead Time When Not In Stock16 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1180.44
50166.93Save 7%
150155.29Save 14%

The Kester 70-3213-0810 is a Series NXG1 no-clean solder paste .

Kester 70-3213-0810 Features:
  • Excellent wetting to a variety of metals
  • Capable of print speeds up to 200 mm/sec (8 in/sec)
  • Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
  • Excellent release from stencil
  • Long stencil and tack life (process dependent)
  • Low voiding behavior
  • Capable of 120 minute break times in printing
  • Clean cosmetic aesthetics after reflow
  • Resistant to slump
  • Longest shelf life at 8 months
  • Reflowable in air or nitrogen
Kester 70-3213-0810 Specifications:
  • Brand: Kester®
  • Series: NXG1
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Product Description

The Kester 70-3213-0810 is a Series NXG1 no-clean solder paste .

Kester 70-3213-0810 Features:
  • Excellent wetting to a variety of metals
  • Capable of print speeds up to 200 mm/sec (8 in/sec)
  • Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
  • Excellent release from stencil
  • Long stencil and tack life (process dependent)
  • Low voiding behavior
  • Capable of 120 minute break times in printing
  • Clean cosmetic aesthetics after reflow
  • Resistant to slump
  • Longest shelf life at 8 months
  • Reflowable in air or nitrogen
Kester 70-3213-0810 Specifications:
  • Brand: Kester®
  • Series: NXG1
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandKester
SeriesNXG1
Chemical CompositionSn96.5Ag3.0Cu0.5
Product TypeNo-Clean Solder Paste
Physical FormPaste
OdorMild
ApplicationsSoldering
Standards MetIPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
Container TypeJar
Capacity500g
AvailabilityIn Stock
Weight: 0.002
Country Of Origin: US
Our Price: $180.45 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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