NXG1 Series Lead Free No-Clean Solder Paste, Type 3, SAC305, 500g Jar
Hisco #:70-3213-0810-16600
MFG #:70-3213-0810
Our Price: $198.04 Jar-JR
Manufacturer Lead Time When Not In Stock: 20 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 198.03 | |
| 50 | 175.80 | Save 11% |
| 150 | 158.05 | Save 20% |
The Kester 70-3213-0810 is a Series NXG1 no-clean solder paste .
The Kester 70-3213-0810 Features:- Excellent wetting to a variety of metals
- Capable of print speeds up to 200 mm/sec (8 in/sec)
- Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
- Excellent release from stencil
- Long stencil and tack life (process dependent)
- Low voiding behavior
- Capable of 120 minute break times in printing
- Clean cosmetic aesthetics after reflow
- Resistant to slump
- Longest shelf life at 8 months
- Reflowable in air or nitrogen
- Brand: Kester®
- Series: NXG1
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Odor: Mild
- Applications: Soldering
- Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
The Kester 70-3213-0810 is a Series NXG1 no-clean solder paste .
The Kester 70-3213-0810 Features:- Excellent wetting to a variety of metals
- Capable of print speeds up to 200 mm/sec (8 in/sec)
- Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
- Excellent release from stencil
- Long stencil and tack life (process dependent)
- Low voiding behavior
- Capable of 120 minute break times in printing
- Clean cosmetic aesthetics after reflow
- Resistant to slump
- Longest shelf life at 8 months
- Reflowable in air or nitrogen
- Brand: Kester®
- Series: NXG1
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Odor: Mild
- Applications: Soldering
- Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Kester
Series: NXG1
Chemical Composition: Sn96.5Ag3.0Cu0.5
Product Type: No-Clean Solder Paste
Applications: Soldering
Capacity: 500g
Physical Form: Paste
Container Type: Jar
Odor: Mild
Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
Weight: 0.002
Country Of Origin:
Our Price: $198.04 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1