NXG1 Series Lead Free No-Clean Solder Paste, Type 3, SAC305, 500g Jar
Hisco #:70-3213-0810-16600
MFG #:70-3213-0810
Our Price: $225.90 Jar-JR
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 14 days
Minimum Order QTY: 100
Item must be ordered in multiples of 100
Item must be ordered in multiples of 100
| Quantity | Price | Save |
|---|---|---|
| 300 | 214.90 | Save |
The Kester 70-3213-0810 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the SAC305 alloy.
Kester 70-3213-0810 Features:- Excellent wetting to a variety of metals
- Capable of print speeds up to 200 mm/sec (8 in/sec)
- Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
- Excellent release from stencil
- Long stencil and tack life (process dependent)
- Low voiding behavior
- Capable of 120 minute break times in printing
- Clean cosmetic aesthetics after reflow
- Resistant to slump
- Longest shelf life at 8 months
- Reflowable in air or nitrogen
- Brand: Kester®
- Series: NXG1
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC
- Odor: Mild
- Applications: Soldering
- Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
SDS/TDS
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Product Description
The Kester 70-3213-0810 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the SAC305 alloy.
Kester 70-3213-0810 Features:- Excellent wetting to a variety of metals
- Capable of print speeds up to 200 mm/sec (8 in/sec)
- Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
- Excellent release from stencil
- Long stencil and tack life (process dependent)
- Low voiding behavior
- Capable of 120 minute break times in printing
- Clean cosmetic aesthetics after reflow
- Resistant to slump
- Longest shelf life at 8 months
- Reflowable in air or nitrogen
- Brand: Kester®
- Series: NXG1
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC
- Odor: Mild
- Applications: Soldering
- Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Kester
Weight: 1
Country Of Origin: US
Harmonized Code: 3810.90.1000
Our Price: $225.90 Jar-JR
Available to Order - 0 on Hand
Minimum Order QTY: 100
Item must be ordered in multiples of 100
Item must be ordered in multiples of 100