3M™ Wafer De-Taping Tape 3305, 25 mm x 100 m
Hisco #:7010321285-31180
MFG #:7010321285
Our Price: $38.06 RL
List Price: Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 82 days
Minimum Order QTY: 40
Item must be ordered in multiples of 40
Item must be ordered in multiples of 40
| Quantity | Price | Save |
|---|---|---|
| 120 | 37.65 | Save |
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Standard Lead Time: 35 Calendar Days
3M 7010321285 Features:- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
- Color: Green
- Package Quantity: 40 BOX
- Part Number: 3305 PL
- Width: 2.165 in
Product Description
Technical Information
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Product Description
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Standard Lead Time: 35 Calendar Days
3M 7010321285 Features:- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
- Color: Green
- Package Quantity: 40 BOX
- Part Number: 3305 PL
- Width: 2.165 in
Technical Information
Brand: 3M
Country Of Origin: JP
Harmonized Code: 3919.10.2055
UPC Code: 04548623422213
Our Price: $38.06 RL
List Price: Available to Order - 0 on Hand
Minimum Order QTY: 40
Item must be ordered in multiples of 40
Item must be ordered in multiples of 40