US_HISCO_SPIRE

Save 10% when you spend $500+ on solder wire & bar. Code: SOLDER10. Online only. Ends 2/27.

3M logo

3M™ Diamond Slurries, Compounds, Minerals, Lapping Film, DIAMOND COMPOUND 30-H-UB 5 GRAM JAR WENDT 170332

Hisco #:7010482344-31180

MFG #:7010482344

Made in the USA
Non-cancellable. Orders for this product cannot be cancelled after the order is placed. But once received, the items may be returned pending prior approval from Hisco customer service.
Our Price: $110.38 EA
List Price: 121.17 EA
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock10 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1110.38
3105.85Save

3M 7010482344 Specifications:
  • Abrasive Material: Diamond
  • Package Quantity: 1 BOX

Product Description

3M 7010482344 Specifications:
  • Abrasive Material: Diamond
  • Package Quantity: 1 BOX

Technical Information

Brand3M
Country Of Origin: US
Harmonized Code: 3405.90.0000
UPC Code: 00051125754224

Additional Resources

Our Price: $110.38 EA
List Price: 121.17 EA
Available to Order - 0 on Hand
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
North America's Premier Distributor of Mission Critical Materials © 2008-  Copyright Hisco – TestEquity LLC.  All rights reserved.