Effect of voids on thermo-mechanical reliability of solder joints

Morgana Ribas, Ph.D., Siuli Sarkar, Ph.D. Alpha Assembly Solutions, MacDermid Performance Solutions Alpha India R&D Centre Bangalore, KA, India Siuli.Sarkar@alphaassembly.com
Carl Bilgrien, Ph.D., Tom Hunsinger Alpha Assembly Solutions Somerset, NJ USA

The reliability of electronic packages and the effect of voids on solder joints has become a major issue ever since introducing lead-free solder alloys. And, as solder interconnects are becoming a critical element of the of the electronic assembly lifetime, it is crucial to clearly understand the effect of voids in solder joints as voids can sometimes increase or reduce solder joint reliability depending on their size and location.

This study shows the relation between thermo-mechanical reliability of solder joints and the levels of voids derived from solder paste and alloy properties, as well as how conditions such as accelerated thermal cycling influence the levels of voids depending on fatigue life requirements.

 

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