Encapsulate high performance in a low pressure injection molding solution.
Simplify manufacturing in 30 seconds. That's how long it takes to fully encapsulate even delicate printed circuit boards at low pressure and temperature. Your PCBs are immediately ready for handling and testing.
Are you ready for TECHNOMELT®? Innovative, TECHNOMELT low pressure molding material flows in quickly around fragile, miniaturized components. Its unique resin technology encapsulates them, starts reducing stress and forms an outer shell of the device, so you can reduce stress with safeguarded circuitry in fewer manufacturing steps.
Henkel's high performance, hot melt adhesives activate a self-contained, integrated assembly for:
- A simple and clean process
- Fast cycle times
- Complete watertight encapsulation
- High-temperature resistance
- Excellent adhesion to metals, plastics and tough surfaces
- Increased hardness
- Increased throughput
- Total cost reduction
- An advanced, environmentally sustainable solution
Need help inserting a TECHNOMELT low pressure molding solution into your manufacturing process? Sort it all out with a little help from a Hisco rep. Complete our brief form today.