US_HISCO_SPIRE
Alpha Logo

Vaculoy Tri-Kilo Ultra Low Lead Wave Solder Bar, SACX0307, 2.2lb Bar

Hisco #:148408-1998

MFG #:148408

Made in the USA
Our Price: $1,608.00 Case-CA
Manufacturer Lead Time When Not In Stock21 days
Minimum Order QTY: 20
Item must be ordered in multiples of 20

ALPHA 148408 Vaculoy tri-kilo ultra low lead wave bar solder is manufactured using high purity raw materials and the alloy is conditioned using Alpha's vaculoy viscosity and dross lowering treatment. This results in a pure low dross high fluidity solder alloy, which is free of cast impurities and included oxides.

The ALPHA 148408 Features:
  • Copper Dissolution Rate – Low copper dissolution rate, reduced solder-pot maintenance and improved bath life
  • Wetting Speed – 0.75 seconds typical wetting speed compares to SAC305 at 0.65 sec and superior to
  • Sn99.3/Cu0.7 base alloys at 1.0 sec
  • Flat Uniform Deposits – less thickness variance than Sn63/Pb37
  • Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates
  • Gives very good solderability due to the fast wetting speed
  • Compatible with all assembly SAC (Sn/Ag/Cu) based alloys SACX, SAC305 etc
  • Excellent shelf life and ultimate solderability – will improve hole fill on multiple reflow boards
The ALPHA 148408 Specifications:
  • Series: Vaculoy
  • Product Type: Wave Solder Bar
  • Chemical Composition: SACX0307
  • Maximum Melting Temperature: +250°C
  • Minimum Melting Temperature: +240°C
  • Standards Met: J-STD-006A:May 2001, IPC-SF-818

Product Description

ALPHA 148408 Vaculoy tri-kilo ultra low lead wave bar solder is manufactured using high purity raw materials and the alloy is conditioned using Alpha's vaculoy viscosity and dross lowering treatment. This results in a pure low dross high fluidity solder alloy, which is free of cast impurities and included oxides.

The ALPHA 148408 Features:
  • Copper Dissolution Rate – Low copper dissolution rate, reduced solder-pot maintenance and improved bath life
  • Wetting Speed – 0.75 seconds typical wetting speed compares to SAC305 at 0.65 sec and superior to
  • Sn99.3/Cu0.7 base alloys at 1.0 sec
  • Flat Uniform Deposits – less thickness variance than Sn63/Pb37
  • Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates
  • Gives very good solderability due to the fast wetting speed
  • Compatible with all assembly SAC (Sn/Ag/Cu) based alloys SACX, SAC305 etc
  • Excellent shelf life and ultimate solderability – will improve hole fill on multiple reflow boards
The ALPHA 148408 Specifications:
  • Series: Vaculoy
  • Product Type: Wave Solder Bar
  • Chemical Composition: SACX0307
  • Maximum Melting Temperature: +250°C
  • Minimum Melting Temperature: +240°C
  • Standards Met: J-STD-006A:May 2001, IPC-SF-818

Technical Information

BrandAlpha
Weight: 50
Country Of Origin: US
Tariff Code: 8003.00.0100
Our Price: $1,608.00 Case-CA
 
Minimum Order QTY: 20
Item must be ordered in multiples of 20
North America's Premier Distributor of Mission Critical Materials © 2008-  Copyright Hisco – TestEquity LLC.  All rights reserved.