Kester EP256HA Series Solder Paste, Type 3, Sn63Pb37, 500g Jar
Hisco #:SN63EP256-500G-16600
MFG #:70-0202-0510
Our Price: $123.12 Jar
Availability: 32 In Stock
Manufacturer Estimated Lead Time When Not In Stock: 10 days
Minimum Order QTY: 1 Jar
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 123.12 | |
| 24 | 117.12 | Save |
| 72 | 111.68 | Save |
The Kester 70-0202-0510 is a Series EP256HA no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
The Kester 70-0202-0510 Features:- Stable wetting behavior over a wide range of profiles
- Capable of 90 minute break times in printing
- High print speeds to 200+ mm/sec (8+ in/sec)
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
- High activity on all substrates, including OSPs
- Capable of off-pad printing with no solderballs after reflow
- Stencil life:8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hours
- Brand: Kester®
- Series: EP256
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The Kester 70-0202-0510 is a Series EP256HA no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
The Kester 70-0202-0510 Features:- Stable wetting behavior over a wide range of profiles
- Capable of 90 minute break times in printing
- High print speeds to 200+ mm/sec (8+ in/sec)
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
- High activity on all substrates, including OSPs
- Capable of off-pad printing with no solderballs after reflow
- Stencil life:8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hours
- Brand: Kester®
- Series: EP256
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Kester
Availability: In Stock
Our Price: $123.12 Jar
Availability: 32 In Stock
Minimum Order QTY: 1 Jar
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1