8349TFM Thermal Adhesive, Thermally Conductive, Electrically Insulating, 200 mL, 2-Can Kit
Hisco #:10332463
MFG #:8349TFM-200ML
Item must be ordered in multiples of 2
| Quantity | Price | Save |
|---|---|---|
| 6 | 272.38 | Save |
The MG Chemicals 8349TFM-200MLthermal adhesive is a 2-part 1-1 epoxy system. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It meets UL 94V-0 Standard as flame retardant. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.
Features
- Thermal conductivity of 0.9 W/(m·K)
- Flame retardant – meets UL 94V-0
- 1:1 mix ratio
- High dimensional stability
- Working life: 20 minutes
- Cure time: 16 hours at room temperature or 20 minutes at 65 °C (149 °F)
- Provides strong electrical insulation
- High compressive and tensile strength
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs, and other electronic components, but is also suitable in many other applications that require a thermally conductive electrically insulating adhesive.
This thermal glue has a 20-minute working time. We also offer a faster-setting alternative with a 5-minute working time (8329TFF), a heat cure alternative with a 4-hour working time (8329TFS), and a heat cure 1-part alternative with an unlimited working time (9460TC). A silver-filled electrically conductive version and thermal pastes are also available.
Product Description
The MG Chemicals 8349TFM-200MLthermal adhesive is a 2-part 1-1 epoxy system. It is a smooth, dark, off-grey paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It meets UL 94V-0 Standard as flame retardant. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.
Features
- Thermal conductivity of 0.9 W/(m·K)
- Flame retardant – meets UL 94V-0
- 1:1 mix ratio
- High dimensional stability
- Working life: 20 minutes
- Cure time: 16 hours at room temperature or 20 minutes at 65 °C (149 °F)
- Provides strong electrical insulation
- High compressive and tensile strength
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs, and other electronic components, but is also suitable in many other applications that require a thermally conductive electrically insulating adhesive.
This thermal glue has a 20-minute working time. We also offer a faster-setting alternative with a 5-minute working time (8329TFF), a heat cure alternative with a 4-hour working time (8329TFS), and a heat cure 1-part alternative with an unlimited working time (9460TC). A silver-filled electrically conductive version and thermal pastes are also available.
Technical Information
Item must be ordered in multiples of 2