T670 Thermal Grease 80CC, 8OZ Jar
Hisco #:65-00-T670-0080-5200
MFG #:65-00-T670-0080
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 31 days
Minimum Order QTY: 1 Jar
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The Parker 65-00-T670-0080 is a high performance (3.0 W/m-K thermal conductivity) grease ideal for thin bond line applications. T670 is a white material and offers low thermal impedance as it will achieve a very thin bond line of about 0.001 in.
Parker 65-00-T670-0080 Features:- Silicone based materials conduct heat between a hot component and a heat sink or enclosure
- Fills interface variable tolerances in electronics assemblies and heat sink applications
- Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
- Thermally stable and require virtually no compressive force to deform under typical assembly pressures
- Supports high power applications requiring material with minimum bond line thickness and high conductivity
- Ideal for rework and field repair situations
- Brand: Parker
- Package Type: 8oz Jar
- Color: White
- Specific Gravity: 2.6
- Dynamic Viscosity: 350000 cP
- Operating Temperature: -50 to 200°C
- Thermal Conductivity: 3 W/m-K
- Specifications Met: RoHS
- Volume (cm3): 80
- Shelf Life: 24 months
Product Description
Technical Information
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Product Description
The Parker 65-00-T670-0080 is a high performance (3.0 W/m-K thermal conductivity) grease ideal for thin bond line applications. T670 is a white material and offers low thermal impedance as it will achieve a very thin bond line of about 0.001 in.
Parker 65-00-T670-0080 Features:- Silicone based materials conduct heat between a hot component and a heat sink or enclosure
- Fills interface variable tolerances in electronics assemblies and heat sink applications
- Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
- Thermally stable and require virtually no compressive force to deform under typical assembly pressures
- Supports high power applications requiring material with minimum bond line thickness and high conductivity
- Ideal for rework and field repair situations
- Brand: Parker
- Package Type: 8oz Jar
- Color: White
- Specific Gravity: 2.6
- Dynamic Viscosity: 350000 cP
- Operating Temperature: -50 to 200°C
- Thermal Conductivity: 3 W/m-K
- Specifications Met: RoHS
- Volume (cm3): 80
- Shelf Life: 24 months
Technical Information
Brand: Parker
Country Of Origin: US
Harmonized Code: 3910.00.0000
Available to Order - 0 on Hand
Minimum Order QTY: 1 Jar
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1