Heat Transfer Compound Plus, Non-Silicone, 25kg Pail
Hisco #:HTCP25K-23673
MFG #:HTCP25K
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 4409.50 | |
| 3 | 4280.25 | Save 3% |
The Electrolube HTCP25K is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components. HTCP is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
Electrolube HTCP25K Features:- High thermal conductivity
- Designed for use as a thermal interface material
- Avoids issues with silicone and LMW siloxane migration
- Allows simple and efficient rework of components if required
- Brand: Electrolube
- Series: HTCP
- Product Type: Heat Transfer Compound
- Conatainer Size: 25kg
- Container Type: Pail
Product Description
The Electrolube HTCP25K is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components. HTCP is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
Electrolube HTCP25K Features:- High thermal conductivity
- Designed for use as a thermal interface material
- Avoids issues with silicone and LMW siloxane migration
- Allows simple and efficient rework of components if required
- Brand: Electrolube
- Series: HTCP
- Product Type: Heat Transfer Compound
- Conatainer Size: 25kg
- Container Type: Pail
Technical Information
Additional Resources
Item must be ordered in multiples of 1