Hisco #:10329571
MFG #:525-2901-3X
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 219.00 | |
| 3 | 210.01 | Save |
The CircuitMedic 525-2901-3X circuit frames are precision replacement conductor patterns used to repair damaged surface mount pads, lands and circuit traces on printed circuit boards. Manufactured from rolled annealed copper and plated with bright-tin, tin-lead, or nickel-gold, these replacement patterns closely match the geometry and conductivity of the original PCB circuitry.
Each Circuit Frame contains multiple precision-etched pads, lands, or conductor shapes arranged on a small copper frame. The technician simply selects the appropriate pattern, trims it from the frame and bonds it to the circuit board surface using controlled heat and pressure. Versions with dry-film adhesive backing cure in approximately 30 seconds using a bonding iron or bonding system, creating a bond strength comparable to the original circuit without the mess of liquid epoxy.
Circuit Frames are widely used to restore damaged SMT pads, BGA pads, edge contacts, and conductor patterns during PCB repair and rework procedures. The process follows IPC-recommended repair methods and meets the highest conformance levels for circuit board repair.
Product Description
The CircuitMedic 525-2901-3X circuit frames are precision replacement conductor patterns used to repair damaged surface mount pads, lands and circuit traces on printed circuit boards. Manufactured from rolled annealed copper and plated with bright-tin, tin-lead, or nickel-gold, these replacement patterns closely match the geometry and conductivity of the original PCB circuitry.
Each Circuit Frame contains multiple precision-etched pads, lands, or conductor shapes arranged on a small copper frame. The technician simply selects the appropriate pattern, trims it from the frame and bonds it to the circuit board surface using controlled heat and pressure. Versions with dry-film adhesive backing cure in approximately 30 seconds using a bonding iron or bonding system, creating a bond strength comparable to the original circuit without the mess of liquid epoxy.
Circuit Frames are widely used to restore damaged SMT pads, BGA pads, edge contacts, and conductor patterns during PCB repair and rework procedures. The process follows IPC-recommended repair methods and meets the highest conformance levels for circuit board repair.
Technical Information
Item must be ordered in multiples of 1


