ALPHA WS-820 Solder Paste, Lead Free, Water-Soluble, SAC305, 88-3-M19, 500 Gram Jar
Hisco #:152996-1998
MFG #:WS-820
Our Price: $94.00 Jar-JR
Manufacturer Lead Time When Not In Stock: 20 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
Quantity | Price | Save |
---|---|---|
1 | 94.00 | |
24 | 91.25 | Save 3% |
72 | 88.64 | Save 6% |
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Alpha
Series: WS-820
Chemical Composition: Sn96.5Ag3.0Cu0.5
Product Type: Lead-Free Solder Paste
Physical Form: Paste
Applications: Soldering
Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
Container Type: Jar
Capacity: 500g
Minimum Storage Temperature: 44.6
Maximum Storage Temperature: 46.4
Length: 2.5 in.
Width: 2.55 in.
Height: 2.85 in.
Availability: In Stock
Weight: 0.002
Country Of Origin: MX
Our Price: $94.00 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1