Rework Soldering System, 10kg Pot Bath, 380 DegreeC Max Temp, 120 VAC 50/60 Hz, 1050 W

The Hakko FX310-010 Rework Soldering System is designed for efficient multi-component soldering and desoldering in electronics manufacturing, repair, and rework applications. Built as the next-generation successor to the HAKKO 485 Solder Fountain, the FX-310 combines increased solder capacity, a wider operating temperature range, and a separate digital controller for enhanced process control.Its flat-top design accommodates printed circuit boards (PCBs) of virtually any size, while the updated NP01 bayonet-style nozzle system enables faster nozzle changes and greater flexibility across a range of soldering applications.A dedicated control unit provides programmable operating parameters, maintenance tracking, and PC connectivity to help improve consistency and productivity in electronics assembly and rework environments.Note: Nozzles are sold separately.The HAKKO FX-310-010 features a 10 kg solder pot that supports high-volume soldering and rework operations. Its increased capacity and elevated temperature range make it suitable for demanding PCB rework, through-hole soldering, and component removal applications.The flat-top design provides greater clearance around the solder fountain, allowing technicians to work with large circuit boards and complex assemblies more efficiently than traditional solder fountain systems.Routine maintenance is streamlined through a top-opening access plate that provides direct access to the solder pot for cleaning and dross removal.Built-in Ethernet connectivity allows the FX-310 to interface with HAKKO Control Software for enhanced monitoring and process management. The controller also tracks heater and impeller runtime, making preventative maintenance scheduling easier.The separate control unit gives operators precise control over temperature, flow rate, flow time, and descent speed. Five programmable presets help standardize repeatable soldering processes across production and repair environments.The updated NP01 bayonet-style nozzle design reduces setup time and simplifies nozzle replacement, helping operators adapt quickly to different component sizes and soldering requirements.

• High-capacity solder pot holds approximately 10 kg (22 lb.) of solder
• Temperature range: 150°C to 380°C (300°F to 720°F)
• Flat-top solder fountain design for large and small PCB assemblies
• Supports simultaneous multi-component soldering and desoldering
• NP01 bayonet-style nozzle system for quick nozzle changes
• Fast heating and warm-up performance
• Integrated leak detection system
• System status indicator lights for operational monitoring
• Adjustable solder flow rate and flow duration
• Flow timer range: 1 to 999 seconds
• Adjustable slow-down descent function for PCB handling
• Five programmable process presets
• Customizable settings lockout for process control
• Ethernet connectivity for HAKKO Control Software integration
• Foot switch connection for hands-free operation
• Runtime monitoring for heaters and impeller maintenance tracking
• Top-access design for simplified solder pot cleaning and maintenance
• Input voltage: 120 VAC, 50/60 Hz
• Total power consumption: 1050 W
• Temperature setting: 150°C to 380°C
• Adjustable flow time: 1 to 999 seconds
• Adjustable solder flow rate
• Slow-down descent control during PCB processing
• Five programmable operation presets
• Settings lockout for process consistency
• Runtime monitoring for heater and impeller systems
• Ethernet port for HAKKO Control Software
• Foot switch input for start/stop operation