Ablestik Adhesive 968-4
Hisco #:1202934-30769
MFG #:1202934
Item must be ordered in multiples of 8
This item is hazardous and may be subject to an additional handling fee.
The Loctite 1202934 ABLESTIK 968‑4 is a one‑part epoxy adhesive formulated for hybrid microelectronics assembly, component attachment, and lid sealing applications. Designed for precision dispensing and screen printing processes, it delivers reliable bond strength, controlled curing performance, and electrically insulating properties for demanding electronics manufacturing environments. Its paste consistency and B‑stage capability make it well suited for production workflows that require accurate placement, process control, and repeatable results. Built for Consistent Manufacturing Processes The LOCTITE ABLESTIK 968‑4 formulation offers high viscosity for controlled application and extended work life for production environments. It supports both dispensing and screen printing processes, making it suitable for semiconductor packaging, hybrid circuits, and electronic device assembly. The product also meets the requirements of MIL‑STD‑883, Method 5011, supporting use in applications where established industry standards are important.
Loctite 1202934 Features:- Technology: epoxy adhesive
- Physical form: blue paste
- Components: one‑part system
- Cure type: heat cure
- Electrical properties: electrically insulating
- B‑stageable formulation
- Recommended cure schedule: 2 hours at 150°C
- Viscosity: 120,000 cP
- Aluminum shear strength: 2,300 psi
- Meets MIL‑STD‑883 Method 5011 requirements
Product Description
This item is hazardous and may be subject to an additional handling fee.
The Loctite 1202934 ABLESTIK 968‑4 is a one‑part epoxy adhesive formulated for hybrid microelectronics assembly, component attachment, and lid sealing applications. Designed for precision dispensing and screen printing processes, it delivers reliable bond strength, controlled curing performance, and electrically insulating properties for demanding electronics manufacturing environments. Its paste consistency and B‑stage capability make it well suited for production workflows that require accurate placement, process control, and repeatable results. Built for Consistent Manufacturing Processes The LOCTITE ABLESTIK 968‑4 formulation offers high viscosity for controlled application and extended work life for production environments. It supports both dispensing and screen printing processes, making it suitable for semiconductor packaging, hybrid circuits, and electronic device assembly. The product also meets the requirements of MIL‑STD‑883, Method 5011, supporting use in applications where established industry standards are important.
Loctite 1202934 Features:- Technology: epoxy adhesive
- Physical form: blue paste
- Components: one‑part system
- Cure type: heat cure
- Electrical properties: electrically insulating
- B‑stageable formulation
- Recommended cure schedule: 2 hours at 150°C
- Viscosity: 120,000 cP
- Aluminum shear strength: 2,300 psi
- Meets MIL‑STD‑883 Method 5011 requirements
Technical Information
Item must be ordered in multiples of 8