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ALPHA NR-330 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:129736-0005-1998

MFG #:NR-330

Our Price: $192.40 Pail-PA
Manufacturer Lead Time When Not In Stock24 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1196.15
1192.40Save 2%
3188.75Save 4%

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Product Description

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Technical Information

BrandAlpha
ApplicationsSoldering
AvailabilityIn Stock
Capacity5gal
Chemical CompositionRosin; 99.3sn/0.7cu and 96.5sn/3.5ag
ColorClear Colorless
Container TypePail
Height10.7 in.
Length16.5 in.
Maximum Storage Temperature110
Minimum Storage Temperature50
Physical FormLiquid
Product TypeNo-Clean Flux
Shelf Life540 Days From Date of Manufacture
Specific Gravity1.013
Storage ConditionsAmbient 32-77F
Width14.65 in.
Weight: 9
Country Of Origin: 

Additional Resources

Our Price: $192.40 Pail-PA
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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