ALPHA NR-330 VOC-Free No-Clean Solder Flux, 5 Gallon Pail
Hisco #:129736-0005-1998
MFG #:NR-330
Our Price: $192.40Â Pail-PA
Manufacturer Lead Time When Not In Stock:Â 24Â days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 196.15 | |
| 1 | 192.40 | Save 2% |
| 3 | 188.75 | Save 4% |
The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.
ALPHA NR-330 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
- Shelf Life: 18month
- Applications: Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
- Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag
Product Description
Technical Information
Back to top
Product Description
The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.
ALPHA NR-330 Features:- Product Type: No-Clean Flux
- Physical Form: Liquid
- Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
- Shelf Life: 18month
- Applications: Soldering
- Container Type: Pail
- Capacity: 5gal
- Bellcore compliant for assemblies requiring this standard,
- VOC-free to help meet air quality regulations,
- Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
- Thermally stable activators provide low solder bridging,
- Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
- Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
- Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag
Technical Information
Brand:Â Alpha
Applications:Â Soldering
Availability:Â In Stock
Capacity:Â 5gal
Chemical Composition:Â Rosin; 99.3sn/0.7cu and 96.5sn/3.5ag
Color:Â Clear Colorless
Container Type:Â Pail
Height:Â 10.7 in.
Length:Â 16.5 in.
Maximum Storage Temperature:Â 110
Minimum Storage Temperature:Â 50
Physical Form:Â Liquid
Product Type:Â No-Clean Flux
Shelf Life:Â 540 Days From Date of Manufacture
Specific Gravity:Â 1.013
Storage Conditions:Â Ambient 32-77F
Width:Â 14.65 in.
Weight:Â 9
Country Of Origin:Â
Additional Resources
Our Price: $192.40Â Pail-PA
Â
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1