US_HISCO_SPIRE
Alpha Logo

ALPHA NR-330 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:129736-0005-1998

MFG #:NR-330

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $196.15 Pail-PA
Manufacturer Lead Time When Not In Stock19 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1196.15
3192.35Save 2%

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Product Description

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Technical Information

BrandAlpha
Product TypeNo-Clean Flux
Physical FormLiquid
Chemical CompositionRosin; 99.3sn/0.7cu and 96.5sn/3.5ag
Shelf Life540 Days From Date of Manufacture
ApplicationsSoldering
Container TypePail
Capacity5gal
Length16.5 in.
Width14.65 in.
Height10.7 in.
AvailabilityIn Stock
ColorClear Colorless
Maximum Storage Temperature77
Minimum Storage Temperature32
Specific Gravity1.013
Weight: 9
Country Of Origin: MX

Additional Resources

Our Price: $196.15 Pail-PA
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
North America's Premier Distributor of Mission Critical Materials ® © 2008-  Copyright Hisco, Inc. Industrial Distributor. All rights reserved