ALPHA OM-6106 No-Clean Solder Paste, Sn62Pb36Ag2.0, 89.5-3-M14, 700g Cartridge
Hisco #:142612-1998
MFG #:OM-6106
Our Price: $224.56 Cartridge-CQ
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 20 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24
Item must be ordered in multiples of 24
| Quantity | Price | Save |
|---|---|---|
| 72 | 218.95 | Save |
The ALPHA OM-6106 is a Series OM6106 no-clean solder paste .
The ALPHA OM-6106 Features:- ALPHA OM-6106 is suitable for ultra-fine pitch applications such as 0.5 mm (20 mil) pitch Flip-Chip and 0201 assembly
- Excellent print repeatability to 0.25 mm (10 mil) circles at high print speeds (based upon a 0.125 mm (5 mil) stencil thickness)
- Excellent response to pause performance, generating less defects due to start up
- Uses universally available Type 3 powder
- High print speed, up to 200 mm/sec (8/sec) and fast release speed to give rapid print cycle times
- Low residue level with minimal spread for reliable underfilling processes and results
- Excellent solderballing characteristics
- Excellent reliability properties, halide-free material
- Series: OM6106
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn62Pb36Ag2
- Applications: Soldering
- Standards Met: REL-0 Classification IPC J-STD-004, Bellcore GR78-CORE, DIN Standard 32 513, IPC J-STD-005B
- Capacity: 700g
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA OM-6106 is a Series OM6106 no-clean solder paste .
The ALPHA OM-6106 Features:- ALPHA OM-6106 is suitable for ultra-fine pitch applications such as 0.5 mm (20 mil) pitch Flip-Chip and 0201 assembly
- Excellent print repeatability to 0.25 mm (10 mil) circles at high print speeds (based upon a 0.125 mm (5 mil) stencil thickness)
- Excellent response to pause performance, generating less defects due to start up
- Uses universally available Type 3 powder
- High print speed, up to 200 mm/sec (8/sec) and fast release speed to give rapid print cycle times
- Low residue level with minimal spread for reliable underfilling processes and results
- Excellent solderballing characteristics
- Excellent reliability properties, halide-free material
- Series: OM6106
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn62Pb36Ag2
- Applications: Soldering
- Standards Met: REL-0 Classification IPC J-STD-004, Bellcore GR78-CORE, DIN Standard 32 513, IPC J-STD-005B
- Capacity: 700g
Technical Information
Brand: Alpha
Weight: 1.4000000000000001
Country Of Origin: MX
Harmonized Code: 3810.10.0000
UPC Code: No UPC
Additional Resources
Our Price: $224.56 Cartridge-CQ
Available to Order - 0 on Hand
Minimum Order QTY: 24
Item must be ordered in multiples of 24
Item must be ordered in multiples of 24