ALPHA OM-5100 Fine Pitch No-Clean Solder Paste, Sn63Pb37, 90-3-M13, 500 Gram Jar
Hisco #:143392-1998
MFG #:OM-5100
Our Price: $87.85 Jar-JR
Manufacturer Lead Time When Not In Stock: 18 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
Quantity | Price | Save |
---|---|---|
1 | 87.85 | |
24 | 85.28 | Save 3% |
72 | 82.84 | Save 6% |
The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.
ALPHA OM-5100 Features:
ALPHA OM-5100 Features:
- Quick start up and simple substition from current material
- Lower deposit-to-deposit variation of pass print and relow yields
- Solder ball reduction minimizing both mid chip and random solder balls
- Excellent solder spread and compatible with a variety of pad and lead finishes
- Responds to pause performance, generating less defects due to start up
- High print speed of up to 150mm/sec
- Efficient activation system provides defect free soldering with a wide range of oven profiles
- Excellent reliability properties and halide-free material
- Series: OM-5100
- Product type: No-clean solder paste
- Physical form: Paste
- Chemical composition: Sn63Pb37
- Container: Jar
- Size: 500g
- Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.
ALPHA OM-5100 Features:
ALPHA OM-5100 Features:
- Quick start up and simple substition from current material
- Lower deposit-to-deposit variation of pass print and relow yields
- Solder ball reduction minimizing both mid chip and random solder balls
- Excellent solder spread and compatible with a variety of pad and lead finishes
- Responds to pause performance, generating less defects due to start up
- High print speed of up to 150mm/sec
- Efficient activation system provides defect free soldering with a wide range of oven profiles
- Excellent reliability properties and halide-free material
- Series: OM-5100
- Product type: No-clean solder paste
- Physical form: Paste
- Chemical composition: Sn63Pb37
- Container: Jar
- Size: 500g
- Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH
Technical Information
Brand: Alpha
Availability: In Stock
Weight: 1
Country Of Origin: MX
Tariff Code: 3810.10.01.00
Our Price: $87.85 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1