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ALPHA OM-5100 Fine Pitch No-Clean Solder Paste, Sn63Pb37, 90-3-M13, 500 Gram Jar

Hisco #:143392-1998

MFG #:OM-5100

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
Our Price: $87.85 Jar-JR
Manufacturer Lead Time When Not In Stock18 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
187.85
2485.28Save 3%
7282.84Save 6%
The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.

ALPHA OM-5100 Features:
  • Quick start up and simple substition from current material
  • Lower deposit-to-deposit variation of pass print and relow yields
  • Solder ball reduction minimizing both mid chip and random solder balls
  • Excellent solder spread and compatible with a variety of pad and lead finishes
  • Responds to pause performance, generating less defects due to start up
  • High print speed of up to 150mm/sec
  • Efficient activation system provides defect free soldering with a wide range of oven profiles
  • Excellent reliability properties and halide-free material
ALPHA OM-5100 Specifications:
  • Series: OM-5100
  • Product type: No-clean solder paste
  • Physical form: Paste
  • Chemical composition: Sn63Pb37
  • Container: Jar
  • Size: 500g
  • Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH

Product Description

The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.

ALPHA OM-5100 Features:
  • Quick start up and simple substition from current material
  • Lower deposit-to-deposit variation of pass print and relow yields
  • Solder ball reduction minimizing both mid chip and random solder balls
  • Excellent solder spread and compatible with a variety of pad and lead finishes
  • Responds to pause performance, generating less defects due to start up
  • High print speed of up to 150mm/sec
  • Efficient activation system provides defect free soldering with a wide range of oven profiles
  • Excellent reliability properties and halide-free material
ALPHA OM-5100 Specifications:
  • Series: OM-5100
  • Product type: No-clean solder paste
  • Physical form: Paste
  • Chemical composition: Sn63Pb37
  • Container: Jar
  • Size: 500g
  • Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH

Technical Information

BrandAlpha
AvailabilityIn Stock
Weight: 1
Country Of Origin: MX
Tariff Code: 3810.10.01.00
Our Price: $87.85 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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