ALPHA OM-5100 Fine Pitch No-Clean Solder Paste, Sn63Pb37, 90-3-M13, 500 Gram Jar
Hisco #:143392-1998
MFG #:OM-5100
Our Price: $85.13 Jar-JR
Manufacturer Lead Time When Not In Stock: 24 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 85.13 | |
| 24 | 82.64 | Save 3% |
| 72 | 80.28 | Save 6% |
The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.
ALPHA OM-5100 Features:
ALPHA OM-5100 Features:
- Quick start up and simple substition from current material
- Lower deposit-to-deposit variation of pass print and relow yields
- Solder ball reduction minimizing both mid chip and random solder balls
- Excellent solder spread and compatible with a variety of pad and lead finishes
- Responds to pause performance, generating less defects due to start up
- High print speed of up to 150mm/sec
- Efficient activation system provides defect free soldering with a wide range of oven profiles
- Excellent reliability properties and halide-free material
- Series: OM-5100
- Product type: No-clean solder paste
- Physical form: Paste
- Chemical composition: Sn63Pb37
- Container: Jar
- Size: 500g
- Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH
Product Description
Technical Information
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Product Description
The ALPHA OM-5100 is a low-residue no-clean solder paste designed to maximize SMT line yields and is formulated to provide excellent repeatability and resistance to environmental conditions.
ALPHA OM-5100 Features:
ALPHA OM-5100 Features:
- Quick start up and simple substition from current material
- Lower deposit-to-deposit variation of pass print and relow yields
- Solder ball reduction minimizing both mid chip and random solder balls
- Excellent solder spread and compatible with a variety of pad and lead finishes
- Responds to pause performance, generating less defects due to start up
- High print speed of up to 150mm/sec
- Efficient activation system provides defect free soldering with a wide range of oven profiles
- Excellent reliability properties and halide-free material
- Series: OM-5100
- Product type: No-clean solder paste
- Physical form: Paste
- Chemical composition: Sn63Pb37
- Container: Jar
- Size: 500g
- Standards met: ROL0, IPC J-STD-004, IPC J-STD-005, REACH
Technical Information
Brand: Alpha
Applications: Soldering, Desoldering
Availability: In Stock
Capacity: 500g
Chemical Composition: Sn63Pb37
Container Type: Jar
Maximum Storage Temperature: 50
Minimum Storage Temperature: 32
Physical Form: Paste
Product Type: Fine Pitch Solder Paste
Series: OM-5100
Standards Met: ROL0 IPC J-STD-004, IPC J-STD-005, DIN Standard 32 513, 5.3, REACH Compliant
Weight: 0.002
Country Of Origin: MX
Our Price: $85.13 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1