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ALPHA WS-809 Water-Soluble Solder Paste, Sn63Pb37, 89.8-3-M18, 500g Jar

Hisco #:148974-1998

MFG #:WS-809

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
Our Price: $85.38 Jar-JR
Manufacturer Lead Time When Not In Stock19 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
185.38
2482.87Save 3%
7280.51Save 6%

The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.

The ALPHA WS-809 Features:
  • Excellent volume transfer efficiency over broad range of environmental conditions
  • Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
  • High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
  • Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
  • Water cleanable after two paste reflow cycles
  • Excellent low voiding performance that exceeds IPC Class III requirement
  • Superior solder spread performance on Cu OSP
The ALPHA WS-809 Specifications:
  • Series: WS809
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Odorless
  • Specific Gravity: 4.4g/cc
  • Flash Point: 185°C
  • Applications: Soldering, Desoldering
  • Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
  • Container Type: Jar
  • Capacity: 500g

Product Description

The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.

The ALPHA WS-809 Features:
  • Excellent volume transfer efficiency over broad range of environmental conditions
  • Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
  • High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
  • Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
  • Water cleanable after two paste reflow cycles
  • Excellent low voiding performance that exceeds IPC Class III requirement
  • Superior solder spread performance on Cu OSP
The ALPHA WS-809 Specifications:
  • Series: WS809
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Odorless
  • Specific Gravity: 4.4g/cc
  • Flash Point: 185°C
  • Applications: Soldering, Desoldering
  • Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandAlpha
ApplicationsSoldering, Desoldering
AvailabilityIn Stock
Capacity500g
Chemical CompositionSn63Pb37
Container TypeJar
Flash Point185°C
Height2.85 in.
Length2.55 in.
Maximum Storage Temperature50
Minimum Storage Temperature32
OdorOdorless
Physical FormPaste
Product TypeWater-Soluble Solder Paste
SeriesWS-809
Specific Gravity4.4g/cc
Standards MetIPC Class III, IPC J-STD-005, IPC J-STD-004A
Width2.55 in.
Weight: 0.002
Country Of Origin: MX
Our Price: $85.38 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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