ALPHA WS-809 Water-Soluble Solder Paste, Sn63Pb37, 89.8-3-M18, 500g Jar
Hisco #:148974-1998
MFG #:WS-809
Our Price: $85.13 Jar-JR
Manufacturer Lead Time When Not In Stock: 23 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 85.13 | |
| 24 | 82.64 | Save 3% |
| 72 | 80.28 | Save 6% |
The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.
The ALPHA WS-809 Features:- Excellent volume transfer efficiency over broad range of environmental conditions
- Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
- High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
- Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
- Water cleanable after two paste reflow cycles
- Excellent low voiding performance that exceeds IPC Class III requirement
- Superior solder spread performance on Cu OSP
- Series: WS809
- Product Type: Water-Soluble Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Odorless
- Specific Gravity: 4.4g/cc
- Flash Point: 185°C
- Applications: Soldering, Desoldering
- Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
The ALPHA WS-809 is a Series WS809 water-soluble solder paste with a flash point of 185.
The ALPHA WS-809 Features:- Excellent volume transfer efficiency over broad range of environmental conditions
- Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
- High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
- Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
- Water cleanable after two paste reflow cycles
- Excellent low voiding performance that exceeds IPC Class III requirement
- Superior solder spread performance on Cu OSP
- Series: WS809
- Product Type: Water-Soluble Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Odorless
- Specific Gravity: 4.4g/cc
- Flash Point: 185°C
- Applications: Soldering, Desoldering
- Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Alpha
Availability: In Stock
Series: WS-809
Chemical Composition: Sn63Pb37
Product Type: Water-Soluble Solder Paste
Applications: Soldering, Desoldering
Capacity: 500g
Length: 2.55 in.
Physical Form: Paste
Width: 2.55 in.
Height: 2.85 in.
Container Type: Jar
Odor: Odorless
Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
Flash Point: 185°C
Specific Gravity: 4.4g/cc
Minimum Storage Temperature: 32
Maximum Storage Temperature: 50
Weight: 0.002
Country Of Origin:
Our Price: $85.13 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1