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EF-2210 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:150996-0005-1998

MFG #:150996-0005

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
Our Price: $224.80 Pail-PA
Manufacturer Lead Time When Not In Stock24 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1224.80
3220.45Save 2%

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Product Description

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Technical Information

BrandAlpha
AvailabilityIn Stock
Weight: 45.099999999999994
Country Of Origin: MX
Tariff Code: 3810.90.9999
Our Price: $224.80 Pail-PA
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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