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EF-2210 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:150996-0005-1998

MFG #:150996-0005

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $211.00 Pail-PA
Manufacturer Lead Time When Not In Stock28 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1211.00
1206.95Save 2%
3203.00Save 4%

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Product Description

The ALPHA 150996-0005 is a no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills for OSP-coated, bare copper boards.

ALPHA 150996-0005 Features:
  • Product Type: No-Clean Flux
  • Chemical Composition: Rosin
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA 150996-0005 Specifications:
  • Bellcore SIR compliant for assemblies requiring this standard,
  • VOC-Free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Suitable for selective soldering process,
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Performs well in either tin lead or lead-free processes

Technical Information

BrandAlpha
ApplicationsSoldering
AvailabilityIn Stock
Capacity5gal
Chemical CompositionRosin
ColorClear Colorless
Container TypePail
Height14.0 in.
Length10.6 in.
Product TypeNo-Clean Flux
Shelf Life540 Days From Date of Manufacture
Specific Gravity1.015
Storage ConditionsAmbient
Width9.5 in.
Weight: 9.02
Country Of Origin: MX
Our Price: $211.00 Pail-PA
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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