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ALPHA OM-350 Lead Free No-Clean Solder Paste, SAC305, 89-4-M16, 600g Cartridge

Hisco #:151014-1998

MFG #:OM-350

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $125.65 Cartridge-CQ
Manufacturer Lead Time When Not In Stock20 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1125.65
24121.97Save 3%
72118.49Save 6%

The ALPHA OM-350 is a Series OM-350 no-clean solder paste .

The ALPHA OM-350 Features:
  • Excellent Pin-in-Paste (Paste-in-Hole) performance:demonstrated both for printing, dispensing (or pin transfer) SMT applications
  • Long Stencil Life:consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF -90oF) harsh environments
  • Stable Paste Viscosity:allows wide storage and handling window at temperatures up to 30oC for 21 days, and up to 25°C for one month
  • High Tack Force:ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
  • Wide Reflow Profile Window:allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C
  • Robust Solderability:proven to handle difficult wetting requirements of critical lead-free components, such As CSP and QFN...etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL
  • Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
  • Voiding performance:meets highest IPC classification of Class III for important ball grid array components
  • Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering even using long/high thermal soaking without charring or burning
  • First-rate Reliability Properties:excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification
  • Safe and Environmentally Friendly:materials comply with RoHS requirement, as well as TSCA & EINECS. No toxic material used in the paste
The ALPHA OM-350 Specifications:
  • Series: OM-350
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC 305
  • Applications: Soldering
  • Standards Met: ROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
  • Container Type: Cartridge
  • Capacity: 600g

Product Description

The ALPHA OM-350 is a Series OM-350 no-clean solder paste .

The ALPHA OM-350 Features:
  • Excellent Pin-in-Paste (Paste-in-Hole) performance:demonstrated both for printing, dispensing (or pin transfer) SMT applications
  • Long Stencil Life:consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF -90oF) harsh environments
  • Stable Paste Viscosity:allows wide storage and handling window at temperatures up to 30oC for 21 days, and up to 25°C for one month
  • High Tack Force:ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
  • Wide Reflow Profile Window:allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C
  • Robust Solderability:proven to handle difficult wetting requirements of critical lead-free components, such As CSP and QFN...etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL
  • Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
  • Voiding performance:meets highest IPC classification of Class III for important ball grid array components
  • Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering even using long/high thermal soaking without charring or burning
  • First-rate Reliability Properties:excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification
  • Safe and Environmentally Friendly:materials comply with RoHS requirement, as well as TSCA & EINECS. No toxic material used in the paste
The ALPHA OM-350 Specifications:
  • Series: OM-350
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC 305
  • Applications: Soldering
  • Standards Met: ROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
  • Container Type: Cartridge
  • Capacity: 600g

Technical Information

BrandAlpha
SeriesOM-350
Chemical CompositionSn96.5Ag3.0Cu0.5
Product TypeNo-Clean Solder Paste
Physical FormPaste
ApplicationsSoldering
Standards MetROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
Container TypeCartridge
Capacity600g
Minimum Storage Temperature32
Maximum Storage Temperature50
Length1.85 in.
Width1.8 in.
Height7.65 in.
AvailabilityIn Stock
AvailabilityIn Stock
Weight: 0.002
Country Of Origin: MX

Additional Resources

Our Price: $125.65 Cartridge-CQ
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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