ALPHA OM-350 Lead Free No-Clean Solder Paste, SAC305, 89-4-M16, 600g Cartridge
Hisco #:151014-1998
MFG #:OM-350
Our Price: $120.51 Cartridge-CQ
Manufacturer Lead Time When Not In Stock: 24 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 120.51 | |
| 24 | 116.98 | Save 3% |
| 72 | 113.64 | Save 6% |
The ALPHA OM-350 is a Series OM-350 no-clean solder paste .
The ALPHA OM-350 Features:- Excellent Pin-in-Paste (Paste-in-Hole) performance:demonstrated both for printing, dispensing (or pin transfer) SMT applications
- Long Stencil Life:consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF -90oF) harsh environments
- Stable Paste Viscosity:allows wide storage and handling window at temperatures up to 30oC for 21 days, and up to 25°C for one month
- High Tack Force:ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
- Wide Reflow Profile Window:allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C
- Robust Solderability:proven to handle difficult wetting requirements of critical lead-free components, such As CSP and QFN...etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL
- Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
- Voiding performance:meets highest IPC classification of Class III for important ball grid array components
- Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering even using long/high thermal soaking without charring or burning
- First-rate Reliability Properties:excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification
- Safe and Environmentally Friendly:materials comply with RoHS requirement, as well as TSCA & EINECS. No toxic material used in the paste
- Series: OM-350
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Applications: Soldering
- Standards Met: ROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
- Container Type: Cartridge
- Capacity: 600g
Product Description
Technical Information
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Product Description
The ALPHA OM-350 is a Series OM-350 no-clean solder paste .
The ALPHA OM-350 Features:- Excellent Pin-in-Paste (Paste-in-Hole) performance:demonstrated both for printing, dispensing (or pin transfer) SMT applications
- Long Stencil Life:consistent performance for at least 6 hours of continuous printing without addition of new paste. 24 hour SMT production ability achieved from 20oC up to 32oC (68oF -90oF) harsh environments
- Stable Paste Viscosity:allows wide storage and handling window at temperatures up to 30oC for 21 days, and up to 25°C for one month
- High Tack Force:ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
- Wide Reflow Profile Window:allows best quality solderability of complicated, high-density PWB assemblies in both air and nitrogen reflow, using straight ramp or soak profiles up to 200°C
- Robust Solderability:proven to handle difficult wetting requirements of critical lead-free components, such As CSP and QFN...etc. on a variety of lead-free board finishes, OSP-Cu, Immersion Ag, Immersion Sn, ENIG & LF HASL
- Reduced Random Solder Ball Levels:minimizes rework and increases first time yield
- Voiding performance:meets highest IPC classification of Class III for important ball grid array components
- Excellent Solder Joint and Flux Residue Cosmetics:after reflow soldering even using long/high thermal soaking without charring or burning
- First-rate Reliability Properties:excess variety of industry and customer standards, halide free material graded ROL0 according to IPC classification
- Safe and Environmentally Friendly:materials comply with RoHS requirement, as well as TSCA & EINECS. No toxic material used in the paste
- Series: OM-350
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Applications: Soldering
- Standards Met: ROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
- Container Type: Cartridge
- Capacity: 600g
Technical Information
Brand: Alpha
Applications: Soldering
Availability: In Stock
Capacity: 600g
Chemical Composition: Sn96.5Ag3.0Cu0.5
Container Type: Cartridge
Height: 7.65 in.
Length: 1.85 in.
Maximum Storage Temperature: 50
Minimum Storage Temperature: 32
Physical Form: Paste
Product Type: No-Clean Solder Paste
Series: OM-350
Standards Met: ROL0 IPC and IPC Class III, RoHS Compliant, IPC J-STD-004, JIS Z 3197-1986, Bellcore GR78-CORE, JIS-Z-3197-1999, JIS Z3284
Width: 1.8 in.
Weight: 0.002
Country Of Origin:
Additional Resources
Our Price: $120.51 Cartridge-CQ
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1