ALPHA WS-820 Solder Paste, Lead Free, Water-Soluble, SAC305, 88-3-M19, 500 Gram Jar
Hisco #:152996-1998
MFG #:WS-820
Our Price: $92.93Â Jar-JR
Manufacturer Lead Time When Not In Stock:Â 20Â days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 92.92 | |
| 24 | 90.20 | Save 3% |
| 72 | 87.63 | Save 6% |
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
The ALPHA WS-820 is a Series WS-820 lead-free solder paste .
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3.0Cu0.5
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand:Â Alpha
Applications:Â Soldering
Availability:Â In Stock
Capacity:Â 500g
Chemical Composition:Â Sn96.5Ag3.0Cu0.5
Container Type:Â Jar
Height:Â 2.85 in.
Length:Â 2.5 in.
Maximum Storage Temperature:Â 50
Minimum Storage Temperature:Â 32
Physical Form:Â Paste
Product Type:Â Lead-Free Solder Paste
Series:Â WS-820
Standards Met:Â IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
Width:Â 2.55 in.
Weight:Â 0.002
Country Of Origin:Â
Our Price: $92.93Â Jar-JR
Â
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1