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ALPHA WS-820 Solder Paste, Lead Free, Water-Soluble, SAC305, 88-3-M19, 500 Gram Jar

Hisco #:152996-1998

MFG #:WS-820

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
Our Price: $97.21 Jar-JR
Manufacturer Lead Time When Not In Stock20 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
197.21
2494.36Save 3%
7291.67Save 6%

The ALPHA WS-820 is a Series WS-820 lead-free solder paste .

The ALPHA WS-820 Features:
  • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
  • Able to spread and wet using straight ramp or soak reflow profiles in air
  • High spread/wetting lead free paste compatible with lead free alloys and surface finishes
  • High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
  • Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
  • Cleanable with water based cleaning systems
The ALPHA WS-820 Specifications:
  • Series: WS-820
  • Product Type: Lead-Free Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Applications: Soldering
  • Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Product Description

The ALPHA WS-820 is a Series WS-820 lead-free solder paste .

The ALPHA WS-820 Features:
  • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
  • Able to spread and wet using straight ramp or soak reflow profiles in air
  • High spread/wetting lead free paste compatible with lead free alloys and surface finishes
  • High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
  • Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
  • Cleanable with water based cleaning systems
The ALPHA WS-820 Specifications:
  • Series: WS-820
  • Product Type: Lead-Free Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Applications: Soldering
  • Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandAlpha
SeriesWS-820
Chemical CompositionSn96.5Ag3.0Cu0.5
Product TypeLead-Free Solder Paste
Physical FormPaste
ApplicationsSoldering
Standards MetIPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
Container TypeJar
Capacity500g
Minimum Storage Temperature44.6
Maximum Storage Temperature46.4
Length2.5 in.
Width2.55 in.
Height2.85 in.
AvailabilityIn Stock
AvailabilityIn Stock
Weight: 0.002
Country Of Origin: MX
Our Price: $97.21 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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