ALPHA WS-820 Lead Free Water-Soluble Solder Paste, SAC305, 87.5-4-M18, 500 Gram Jar
Hisco #:153515-1998
MFG #:WS-820
Our Price: $108.01 Jar-JR
Manufacturer Lead Time When Not In Stock: 29 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 108.00 | |
| 24 | 104.83 | Save 3% |
| 72 | 101.85 | Save 6% |
The ALPHA WS-820 is a lead-free, halide-free solder paste. WS-820 offers the ideal combination of printability and reflow profile process window with excellent cleanability.
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA WS-820 is a lead-free, halide-free solder paste. WS-820 offers the ideal combination of printability and reflow profile process window with excellent cleanability.
The ALPHA WS-820 Features:- Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
- Cleanable with water based cleaning systems
- Series: WS-820
- Product Type: Lead-Free Solder Paste
- Physical Form: Paste
- Chemical Composition: SAC 305
- Applications: Soldering
- Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Alpha
Availability: In Stock
Weight: 1
Country Of Origin: MX
Tariff Code: 7106.92.01.00
Our Price: $108.01 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1