OM-338-PT Lead Free No-Clean Solder Paste, SAC305, 88.5-4-M16, 500g Jar

153808-1998 MFG #: 153808
$0.21926 / JR
  • Brand Name: Alpha
  • Series: OM-338-PT
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Product Type: Pin-Testable Solder Paste
  • Physical Form: Paste
  • Applications: Soldering, Desoldering
  • Standards Met: IPC Class III ROL0, RoHS Compliant, IPC J-STD-005, IPC J-STD-004A
  • Container Type: Jar
  • Capacity: 500g
  • Minimum Storage Temperature: 32
  • Maximum Storage Temperature: 50
  • Availability: In Stock
The Alpha 153808 is a lead free solder paste designed to minimize transition concerns from tin/lead to lead free solder paste and used in a variety of applications.

Alpha 153808 Features:
  • Maximizes reflow yield for lead free processing
  • Excellent print consistency with high process capability
  • Print speeds of up to 200mm/sec enabling fast print cycle time
  • Wide reflow profile window with good solderability
  • Excellent solder and flux cosmetics after reflow soldering
  • Compatible with either nitrogen or air reflow
Alpha 153808 Specifications:
  • Series: OM-338-PT
  • Product type: Lead free solder paste
  • Physical form: Paste
  • Chemical composition: SAC305
  • Container: Jar
  • Size: 500g
  • Standards met: JESD97, IPC 7095 Class III, J-STD-005, RoHS