ALPHA JP-500 Lead Free No-Clean Solder Paste, SAC305, 87-5-M11, 100 Gram Syringe
Hisco #:153833-1998
MFG #:JP-500
Our Price: $58.95 Syringe-SZ
Manufacturer Lead Time When Not In Stock: 10 days
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48
| Quantity | Price | Save |
|---|---|---|
| 144 | 57.48 | Save 2% |
The ALPHA JP-500 is a Series JP-500 no-clean solder paste .
The ALPHA JP-500 Features:- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25 mm (0.010")
- Excellent deposit consistency with high process capability index across all board designs
- Designed for use with the Mycronic Jet Printers
- Zero Halogen (no halogen intentionally added to the formulation)
- Wide reflow profile window with good solderability on various board/component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Excellent pin-test yield for single and double reflow
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, zero halide material
- Capable of high reflow yield without the use of nitrogen
- Series: JP-500
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3Cu0.5
- Applications: Soldering
- Standards Met: ROL0 per IPC J-STD-004, RoHS Compliant, Bellcore GR78-CORE, IPC J-STD-005, JIS Z3284, DIN Standard 32 513
- Container Type: Syringe
- Capacity: 100g
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA JP-500 is a Series JP-500 no-clean solder paste .
The ALPHA JP-500 Features:- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25 mm (0.010")
- Excellent deposit consistency with high process capability index across all board designs
- Designed for use with the Mycronic Jet Printers
- Zero Halogen (no halogen intentionally added to the formulation)
- Wide reflow profile window with good solderability on various board/component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Excellent pin-test yield for single and double reflow
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, zero halide material
- Capable of high reflow yield without the use of nitrogen
- Series: JP-500
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn96.5Ag3Cu0.5
- Applications: Soldering
- Standards Met: ROL0 per IPC J-STD-004, RoHS Compliant, Bellcore GR78-CORE, IPC J-STD-005, JIS Z3284, DIN Standard 32 513
- Container Type: Syringe
- Capacity: 100g
Technical Information
Brand: Alpha
Series: JP-500
Chemical Composition: Sn96.5Ag3.0Cu0.5
Product Type: No-Clean Solder Paste
Physical Form: Paste
Applications: Soldering
Standards Met: ROL0 per IPC J-STD-004, RoHS Compliant, Bellcore GR78-CORE, IPC J-STD-005, JIS Z3284, DIN Standard 32 513
Container Type: Syringe
Capacity: 100g
Weight: 0.2
Country Of Origin: MX
Additional Resources
Our Price: $58.95 Syringe-SZ
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48