ALPHA CVP-520 Lead-Free Low Temp Paste Flux, 30g Syringe
Hisco #:154257-1998
MFG #:CVP-520
Our Price: $20.40 Syringe-SZ
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 25 days
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48
| Quantity | Price | Save |
|---|---|---|
| 144 | 19.81 | Save |
The ALPHA CVP-520 is a Series CVP-520 solder paste flux.
ALPHA CVP-520 Features:- Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
- Reduces energy consumption in reflow ovens versus standard lead free alloys
- Reduces reflow process cycle time
- Delivers 8 Hour stencil life
- Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
- Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
- Excellent resistance to random solder balling minimizing rework and increasing first time yield
- Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
- Meets highest IPC 7095 voiding performance (Class III)
- Series: CVP-520
- Product Type: Paste Flux
- Applications: Soldering, Desoldering
- Standards Met: IPC 7095 voiding performance Class III, IPC J-STD-005, RoHS Compliant, J-STD-004, JIS Z 3197 -1999 8.4.1, JIS Z 3197 1999, JIS Z-3284-1994 Annex 8
- Container Type: Syringe
- Capacity: 30g
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA CVP-520 is a Series CVP-520 solder paste flux.
ALPHA CVP-520 Features:- Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
- Reduces energy consumption in reflow ovens versus standard lead free alloys
- Reduces reflow process cycle time
- Delivers 8 Hour stencil life
- Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
- Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
- Excellent resistance to random solder balling minimizing rework and increasing first time yield
- Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
- Meets highest IPC 7095 voiding performance (Class III)
- Series: CVP-520
- Product Type: Paste Flux
- Applications: Soldering, Desoldering
- Standards Met: IPC 7095 voiding performance Class III, IPC J-STD-005, RoHS Compliant, J-STD-004, JIS Z 3197 -1999 8.4.1, JIS Z 3197 1999, JIS Z-3284-1994 Annex 8
- Container Type: Syringe
- Capacity: 30g
Technical Information
Brand: Alpha
Weight: 0.06
Country Of Origin: MX
Harmonized Code: 3810.90.5000
UPC Code: No UPC
Additional Resources
Our Price: $20.40 Syringe-SZ
Available to Order - 0 on Hand
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48